Kyocera Doubles Semiconductor Outlay To $9.8B: Report - Kyocera (OTC:KYOCY), Kyocera (OTC:KYOCF)

Kyocera Corp KYOCF KYOCY looked to expand its investment in semiconductors, increasing total capital investment and research and development expenditure to 1.3 trillion yen ($9.78 billion) over the three fiscal years through March 2026.
Kyocera doubled the amount spent during the previous three years to March 2023, Nikkei Asia reports citing President Hideo Tanimoto.
Kyocera will also fundraise by pledging its KDDI shares as collateral for the first time while borrowing up to 1 trillion yen.
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Kyocera eyed aggressive investments in areas including ceramic components betting on near-term chip market expansion.
Kyocera eyed up to 900 billion yen in capex, double the amount over the past three years, and plans to spend 400 billion yen on R&D, up by 60%.
In Kagoshima prefecture in southern Japan, Kyocera invested 60 billion yen to construct a new semiconductor package production facility.
In Nagasaki, Kyocera constructed its first new domestic plant in about 20 years since the start of operations at its Ayabe factory in Kyoto.
Tanimoto said Kyocera earmarked up to 100 billion yen to produce ceramic components and semiconductor packaging, with the new plant set to begin operating in 2026.
The area bears proximity with other chip plants like Sony Group Corp SONY, an expressway interchange, and other transportation infrastructure.
In Vietnam, Kyocera expanded factories producing multifunctional machines and quartz components.
The report added that Kyocera would borrow from banks partly by using its KDDI Corp KDDIY KDDIF shareholdings as collateral.
Kyocera holds 15% of KDDI's issued shares with a market value of 1.35 trillion yen.
Depending on semiconductor market conditions, Kyocera may carry out up to 1 trillion yen in future collateralized borrowing.
Price Action: SONY shares traded lower by 0.22% at $76.77 in the premarket on the last check Tuesday.
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