NXP Enables All-in-One and Standard PCs With eDP-to-LVDS Bridge IC

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EINDHOVEN, NETHERLANDS and SAN JOSE, CA--(Marketwire - September 12, 2011) - At the Intel Developer Forum (IDF) this week, NXP Semiconductors N.V. NXPI will showcase the PTN3460 -- an embedded DisplayPort(TM)-to-LVDS bridge IC ideal for All-in-One PCs and standard PC platforms. In the first half of 2011, analyst firm Gap Intelligence observed a 28-percent increase in the number of touchscreen All-in-One PCs offered at major retailers it tracks, and some observers have suggested that AIOs could account for 20 percent of the total desktop PC market next year. However, while LVDS continues to be used widely in PC display panels including All-in-One PCs, major chip manufacturers are now removing LVDS support from their chipsets and GPUs in order to optimize power consumption and adopt sub-micron technology. The PTN3460 from NXP provides a protocol conversion bridge between an eDP source and an LVDS display panel.

With both an embedded microcontroller and on-chip flash memory, the PTN3460 makes it easy to update firmware. Advanced features available only in the PTN3460 include on-chip EDID ROM emulation, which enables the replacement of discrete EDID ROMs up to 1kB. This unique capability enables system integrators to use panels that don't have built-in EDID ROM. The PTN3460 also offers unmatched flexibility of configuration by offering support for Display Port (DP) over the AUX channel, as well as via the I2C-bus and via hardware pins. Further, the PTN3460 offers "brightness control" functionality, with no additional components required, enabling significant savings in total bill of materials (BoM).

Technical Features:


eDP to LVDS conversion -- compliant with DisplayPort v1.1a/1.2 and eDP v1.1/1.2 standards and supports a link rate of 1.6 /2.7 Gbps with up to two lanes of operation
Supports single or dual LVDS bus operation with pixel clock frequency up to 112 MHz and color depths of 18/24 bits/pixel
Embedded microcontroller and on-chip non-volatile memory (NVM) permitting field-upgradability of firmware
EDID ROM emulation to support display panels with non-EDID or ROM, supporting EDID structure v 1.3 and on-chip EDID emulation up to 1kB
Supports multiple configuration options -- I2C bus, DP over AUX, or hardware pins
Offers "brightness control" functionality without additional components such as EEPROM and passive components, saving system BoM
Powered by 3.3-V and/or 1.8-V supplies
Available in the HVQFN56 7-mm x 7-mm package with 0.4-mm pitch


Supporting Quote


"As major CPU/chipset manufacturers remove support for LVDS, the PTN3460 eDP-to-LVDS bridge provides an elegant interface solution for PC OEMs and ODMs. In addition, it reduces the total bill of materials while supporting the latest DisplayPort technologies, making computer configuration and upgrades more flexible and user-friendly," said Grahame Cooney, general manager, High Speed Interface product line, NXP Semiconductors.


Availability and Pricing


The NXP PTN3460 eDP-to-LVDS bridge IC is available in volume immediately, and will be shown at the NXP High Speed Computing booth this week at IDF 2011 in San Francisco, California (booth 730).
Pricing varies by product and volume, starting at $2.30 per unit in quantities of less than 10k.


Links


High-Speed Computing with NXP Interface
NXP PTN3460 eDP-to-LVDS bridge product information
Video: NXP Enables DisplayPort


About NXP Semiconductors
NXP Semiconductors N.V. NXPI provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.


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