DSP Group to Participate at Cowen 2020 Virtual TMT Conference

SAN JOSE, Calif., May 13, 2020 (GLOBE NEWSWIRE) -- DSP Group®, Inc. DSPG, a leading global provider of wireless chipset solutions for converged communications, announced today that it will be participating in the Cowen 2020 Virtual TMT Conference on May 26^th 2020. DSP Group's management is scheduled to present on May 26^th at 09:10am.

Investors will have the opportunity to hold virtual one-on-one meetings with DSP Group management during this conference. Those interested should contact DSP Group's Investor Relations team at ir@dspg.com.

A webcast of the conference presentation will be available in the investor relations section of the company's website at http://ir.dspg.com.

About DSP Group
DSP Group®, Inc. DSPG is a global leader in wireless chipsets for a wide range of smart-enabled devices. The company was founded in 1987 on the principles of experience, insight and continuous advancement which enable the company to consistently deliver next-generation solutions in the areas of voice, audio, video and data connectivity. Experts in voice processing, DSP Group invests heavily in innovation for the smart future, the result is leading-edge semiconductor technology that is enabling our customers to develop a new wave of products that bring enhanced user experiences through innovation, like conversation technology. From mobile phones to VoIP and virtual assistants using cloud-based voice services, DSP Group is the answer to the growing demand for the ever-expanding collection of voice controlled smart devices. For more information, visit www.dspg.com.

Contact:
Tali Chen, Chief Marketing Officer, tel: 1-669-286-9181, tali.chen@dspg.com