Columbus McKinnon Names Appal Chintapalli as Vice President of Engineered Products

Columbus McKinnon Corporation CMCO, a leading designer, manufacturer and marketer of motion control products, technologies and services for material handling, today announced the appointment of Appal Chintapalli as Vice President, Engineered Products. He succeeds John Stewart, who is retiring from Columbus McKinnon after 39 years of service with the Company.

Mark D. Morelli, President and Chief Executive Officer, commented, "As we continue our progress to transform Columbus McKinnon into an industrial technology company, Appal will be a terrific addition to our team. He brings international experience optimizing business changes in Europe, Asia and North America. And, he possesses a keen understanding of technology's impact on business transformation. I am confident his contributions leading our Engineered Products business will be considerable."

Mr. Morelli added, "It has been a pleasure to work with John these last two years, and I appreciate that he delayed his retirement until now so that he could lead the Engineered Products through the early phases of our Blueprint for Growth strategy. We wish him all the best in his retirement."

Mr. Chintapalli will be responsible for continuing the execution of the Blueprint for Growth strategy for the Engineered Products business including the development of product roadmaps with a view toward continuing market leadership, increasing efficiency and delivering profitable growth.

With a strong background as an operating executive in technology and industry, Mr. Chintapalli brings to Columbus McKinnon over 20 years of success in developing strategic roadmaps, identifying growth initiatives and delivering quality execution. Mr. Chintapalli's last four years have been in Germany as the General Manager and Vice President of IT & Edge Infrastructure EMEA for Vertiv, a multi-billion dollar leader in datacenter infrastructure solutions. In this role he both grew revenue and improved margins. Previous to Vertiv, he held progressively challenging positions in leadership with Emerson Electric over eleven years.

Mr. Chintapalli holds an MBA from Harvard Business School, a Masters of Science in Chemical Engineering from the University of Oklahoma, and a Bachelor of Science in Chemical Engineering from Andhra University.

About Columbus McKinnon

Columbus McKinnon is a leading worldwide designer, manufacturer and marketer of motion control products, technologies, systems and services that efficiently and ergonomically move, lift, position and secure materials. Key products include hoists, actuators, rigging tools, light rail work stations and digital power and motion control systems. The Company is focused on commercial and industrial applications that require the safety and quality provided by its superior design and engineering know-how. Comprehensive information on Columbus McKinnon is available at http://www.cmworks.com.

Safe Harbor Statement

This news release contains "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995. Such statements include, but are not limited to, statements concerning future revenue and earnings, involve known and unknown risks, uncertainties and other factors that could cause the actual results of the Company to differ materially from the results expressed or implied by such statements, including the execution of the Blueprint for Growth strategy, the impact of Mr. Chintapalli's contributions to the Company, his ability to improve margins and increase sales, global economic and business conditions, conditions affecting the industries served by the Company and its subsidiaries, conditions affecting the Company's customers and suppliers, competitor responses to the Company's products and services, the overall market acceptance of such products and services, and other factors disclosed in the Company's periodic reports filed with the Securities and Exchange Commission. The Company assumes no obligation to update the forward-looking information contained in this release.

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