Rogers Corporation Files Patent Infringement Lawsuit

Rogers Corporation ROG, today announced that its wholly owned subsidiary, Rogers Germany GmbH, has filed a patent infringement lawsuit in Dusseldorf, Germany against KCC Corporation of Seoul, Korea. In the complaint, Rogers alleges that KCC infringes a Rogers patent by offering in Germany direct bonded copper (DBC) substrate master cards which contain specific features that are patented in Germany. The complaint is based on the German part of European Patent No. 1 061 783 in the form maintained by the European Patent Office subsequent to a validity challenge by means of opposition proceedings. An appeal against the first instance decision on validity has been filed by all parties of the opposition proceedings which is currently pending before the Boards of Appeal of the European Patent Office.

"Rogers is a technology leader in providing materials-based solutions in many different application areas, and we will enforce our patent rights to protect our substantial investment in innovation," said Robert C. Daigle, Senior Vice President and Chief Technology Officer of Rogers Corporation.

DBC substrates are electrically insulating and thermally conductive industrial ceramics to which copper foil has been directly bonded. The result is a metallized ceramic substrate with high thermal conductivity, superior heat spreading capability and low thermal expansion properties, all of which are essential for high performance power electronics applications.

About Rogers Corporation

Rogers Corporation ROG is a global leader in engineered materials to power, protect, and connect our world. With more than 180 years of materials science experience, Rogers delivers high-performance solutions that enable clean energy, internet connectivity, safety and protection applications as well as other technologies where reliability is critical. Rogers delivers Power Electronics Solutions for energy-efficient motor drives, vehicle electrification and alternative energy; Elastomeric Material Solutions for sealing, vibration management and impact protection in mobile devices, transportation interiors, industrial equipment and performance apparel; and Advanced Connectivity Solutions for wireless infrastructure, automotive safety and radar systems. Headquartered in Arizona (USA), Rogers operates manufacturing facilities in the United States, China, Germany, Belgium, Hungary, and South Korea, with joint ventures and sales offices worldwide. For more information, visit www.rogerscorp.com.

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