Applied Materials Launches Sculpta To Cut Advanced Chipmaking Cost, Wins Intel As Client

  • Applied Materials, Inc AMAT showcased a patterning technology that helped chipmakers to create high-performance transistors and interconnect wiring with fewer EUV lithography steps, thereby lowering the cost, complexity, and environmental impact of advanced chipmaking.
  • To help chipmakers shrink designs without the added cost, complexity, and energy and materials consumption of EUV double patterning, Applied Materials worked closely with leading customers to develop the Centura Sculpta patterning system. 
  • Chipmakers can now print a single EUV pattern and then use the Sculpta system to elongate the shapes in any chosen direction to reduce the space between features and increase pattern density. 
  • The Sculpta system can provide chipmakers with capital cost savings of $250 million per 100K wafer starts per month of production capacity, manufacturing cost savings of $50 per wafer, and energy savings of more than 15 kWh per wafer, the company said.
  • Ryan Russell, corporate vice president for logic technology development at Intel Corp INTC, said, "Having collaborated closely with Applied Materials in the optimization of Sculpta around our process architecture, Intel will be deploying pattern-shaping capabilities to help us deliver reduced design and manufacturing costs, process cycle times and environmental impact."
  • Applied Materials also launched a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
  • Applied's new VeritySEM 10 system features a unique architecture that enables low-landing energy at 2X better resolution than conventional CD-SEMs. 
  • It also provides a 30% faster scan rate to reduce interaction with the photoresist and increase throughput​. 
  • Keith Wells, Group Vice President of Imaging and Process Control, stated, "The system's unique combination of low landing energy, high resolution, and faster imaging speed helps pave the way to High-NA EUV, Gate-All-Around transistors, and high-density 3D NAND."
  • Price Action: AMAT shares traded higher by 3.89% at $116.43 on the last check Tuesday.
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