STMicroelectronics Taps Synopsys' AI Chips For Cloud Scaling

Synopsys, Inc SNPS reached scale for AI-driven chip designs as major semiconductor customers registered the first 100 commercial tape-outs with the company's autonomous design system.
Synopsys' recent customers, including STMicroelectronics NV STM and SK Hynix Inc HXSCL, saw significant productivity and a PPA uplift.
The companies charted a new design course using reinforcement learning-enabled design tools on the cloud and on-premise.
STMicroelectronics taped-out using Synopsys DSO.ai coupled with Synopsys Fusion Compiler and Synopsys IC Compiler II physical implementation tools.
"Using the Synopsys DSO.ai design system on Microsoft Corp MSFT Azure, we increased PPA exploration productivity by more than 3x, allowing us fast implementation of a new Arm core while exceeding power, performance and area goals," said Philippe d'Audigier, system-on-chip hardware design director at STMicroelectronics.
Junhyun Chun, head of SoC (System on Chip) at SK Hynix, said, "Synopsys DSO.ai brings a huge amount of design team efficiency, giving our engineers more time to create differentiated features for our next generation of products. It's also driving fantastic results as demonstrated in a recent project where DSO.ai delivered a 15% cell area reduction and a 5% die shrink."
Jean Boufarhat, corporate vice president of engineering, Azure said, "With AI-powered chip design on Azure, companies can leverage cloud-scaling to boost productivity and optimize very large solution spaces like high-performance computing."
Price Action: STM shares trade lower by 1.05% at $49.00 premarket on the last check Wednesday.