This Leading South Korean Chipmaker Eyes US For Advanced Chip Packaging Plant: Report

This Leading South Korean Chipmaker Eyes US For Advanced Chip Packaging Plant: Report
  • South Korea's SK Hynix Inc HXSCL targeted a U.S. site for its advanced chip packaging plant and break ground there around the first quarter of 2023, Reuters reports.
  • The plant, worth "several billions," would ramp up to mass production by 2025-2026 and employ 1,000 workers.
  • The plant will likely be near a university with engineering talent.
  • SK Group, South Korea's second-biggest conglomerate, owner of SK Hynix, announced the new plant in July as part of a $22 billion U.S.-based investment package in semiconductors, green energy, and bioscience projects. 
  • It looked to allocate $15 billion to the semiconductor industry through research and development programs, materials, and the creation of an advanced packaging and testing facility.
  • The U.S.'s CHIPS and Science Act of 2022 aim to spend $52.7 billion to drive industry resilience against China.
  • Taiwan Semiconductor Manufacturing Company Ltd TSMIntel Corp INTC, and Samsung Electronics Co, Ltd SSNLF are the front-runners for the U.S. grant as they are amid massive expansion plans in the country.

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