Skip to main content

Market Overview

TSM To Raise $575M Via Debt To Counter Chip Crisis: Bloomberg

  • Taiwan Semiconductor Manufacturing Co Ltd (NYSE: TSM) is set to sell local currency bonds in Taiwan to raise its spending capacity amidst the semiconductor chip crisis. The company intends to raise $575 million (NT$16 billion) in a debt offering in three parts via auction, Bloomberg reports. The issuance amount is subjected to changes.
  • The recent rise in global corporate bond yields could act as a dampener for the offering.
  • Recently Taiwan Economic Minister Wang Mei-Hua assured support to the U.S. as the latter reached out to tackle the auto chip crisis. TSM disclosed its plans to raise its capital expenditure to $28 billion to solve the crisis, including a $12 billion plant in Arizona. It led to the approval of NT$120 billion debt offering and dollar note issuance guarantee up to $4.5 billion.
  • The initiative could not have been more appropriately timed, considering the key component crisis plaguing everything from smartphones, televisions, and cars.
  • Price action: TSM shares are down 0.88% at $131.23 on the last check Thursday.
  • Related News: Biden Seeks $37B In Congressional Funding To Counter Chip Crisis: Reuters

Related Articles (TSM)

View Comments and Join the Discussion!

Posted-In: Bloomberg semiconductorsNews Offerings Tech Media

Don't Miss Any Updates!
News Directly in Your Inbox
Subscribe to:
Benzinga Premarket Activity
Get pre-market outlook, mid-day update and after-market roundup emails in your inbox.
Market in 5 Minutes
Everything you need to know about the market - quick & easy.
Fintech Focus
A daily collection of all things fintech, interesting developments and market updates.
Everything you need to know about the latest SPAC news.
Thank You

Thank you for subscribing! If you have any questions feel free to call us at 1-877-440-ZING or email us at