Taiwan Semiconductor Approved Capital Appropriations of ~$3.96B for Capacity Expansion of Advanced Technology and Packaging and Assembly

TSMC TSM today held a meeting of the Board of Directors, which passed the following resolutions: 1. Approved capital appropriations of approximately US$3,963.3 million for purposes of capacity expansion of advanced technology and packaging and assembly; construction of fab facilities and installation of facility systems; first quarter 2016 R&D capital investments and sustaining capital expenditures. 2. Approved the promotion of Dr. Y.L. Wang as Vice President.