Market Overview

UPDATE: Oramed Signs up to $50M Licensing and Investment Agreements for Oral Insulin Capsule in China

Share:
Related
10 Stocks Gaining In Wednesday's Pre-Market: Heavy M&A Activity
Oramed's Phase IIb Oral Insulin Study Meets Primary Safety And Efficacy Endpoints

Oramed Pharmaceuticals Inc. (NASDAQ: ORMP), a clinical-stage pharmaceutical company focused on the development of oral drug delivery systems, announced today it has signed definitive licensing and investment agreements valued at up to $50,000,000 with Hefei Tianhui Incubator of Technologies Co., Ltd. ("HTIT") for exclusive rights to market Oramed's oral insulin capsule, ORMD-0801, in China, Hong Kong and Macau. The agreements were signed at the Israel Knesset (Parliament).

The license agreement payments include a $3 million payment due upon execution of the agreement, $8 million in near-term payments subject to Oramed entering into certain agreements and the balance payable upon achievement of certain milestones. In addition, if all conditions are met, HTIT will pay a 10% royalty on net sales of the related commercialized products.

In addition to the contemplated payments under the license agreement, pursuant to the investment agreement, Oramed will issue to HTIT 1,155,469 restricted shares of Oramed's common stock at a price per share of approximately $10.39 and $12 million in total, subject to customary closing conditions.

"China recently became the country with the largest number of diabetics in the world. Having signed these definitive license and investment agreements, our oral insulin capsule could help serve the growing population of people in China living with diabetes," stated Oramed's CEO Nadav Kidron. "In addition to the $50 million in milestone payments and investments, we believe the royalties on net sales throughout China will have a very significant impact on Oramed's future revenues and earnings, upon market approval of ORMD-0801 in China."

Posted-In: News Press Releases

 

Related Articles (ORMP)

View Comments and Join the Discussion!