Lam Research Acquires SEMSYSCO Enabling Better HPC, AI Solutions

Lam Research Acquires SEMSYSCO Enabling Better HPC, AI Solutions
  • Lam Research Corp LRCX completed the acquisition of SEMSYSCO GmbH, a global provider of wet processing semiconductor equipment, from Gruenwald Equity and other investors. The financial terms of the transaction remain undisclosed.
  • With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging, ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI), and other data-intensive applications. 
  • Also Read: China-Related Headwinds Force Chip Analyst To Slash Expectations on Lam Research, Applied Materials
  • The acquisition of SEMSYSCO broadens Lam's packaging offerings, bringing a portfolio of innovative cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. 
  • "New substrate-based panel-level approaches are vital to cost-effectively realizing the high-performance chiplet-based solutions needed for the digital world," said Keyvan Esfarjani, chief global operations officer at Intel Corp INTC. "We are pleased to expand our deep, long-standing relationship with Lam to include advanced cleaning and plating processes in the new panel form factor."
  • Tim Archer, CEO at Lam Research, said, "With innovative offerings and leading-edge research and development in packaging, Lam is well-positioned to support our customers as they scale to future chiplet-based technologies."
  • With the acquisition of SEMSYSCO, Lam also gains a state-of-the-art R&D facility in Austria focused on next-generation substrates and heterogeneous packaging, broadening the company's strong development capabilities in Europe and adding a sixth lab in Lam's global network. 
  • Lam Research held $4.6 billion in cash and equivalents as of September 30.
  • Price Action: LRCX shares traded higher by 1.24% at $486.65 on the last check Tuesday.
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