The majority of the orders are for the manufacturing of chiplet modules and High Bandwidth Memory (HBM) for heterogeneous integration. 

The systems are expected to be delivered during the second half of 2023.

The company noted that order momentum increases expectations for a stronger second half 2023.

"We expect that the trend of growing demand for increased computing power supporting AI and data centers will continue and will lead to increasing capacity of chiplet modules and HBM for heterogeneous integration. Given the trend, we anticipate receiving further orders for similar applications in the near future," commented Mr. Rafi Amit, Camtek's CEO.

Price Action: CAMT shares traded higher by 8.29% at $36.70 premarket on Thursday.