Amkor Technology Inc was formed in September 1997. It provides outsourced semiconductor packaging and test services. It is engaged in designing and developing new packaging & test technologies and offers a portfolio of packaging solutions & services. It has diversified operational scope with research & development, engineering and production capabilities at various facilities throughout China, Japan, Korea, the Philippines, Taiwan and the United States. The Taiwan facility has solder bumping line with HVM production capability for 200 millimeter and 300 millimeter wafers. The wafer probe testing services provides visual inspection and electrical testing of the wafer for defects prior to packaging. It also offers thermal controlled probe, bumped wafer probe, single and double pass probe and multi-site probe among others. The packaging and test services are designed to meet application and chip specific requirements including the type of interconnect technology employed; size; thickness and electrical, mechanical and thermal performance. It provides its services to integrated device manufacturers, fabless semiconductor companies and contract foundries. Some of the company's customers are Intel Corporation; Micron Technology, Inc.; STMicroelectronics N.V.; Texas Instruments Incorporated, Toshiba Corporation, Altera Corporation; Broadcom Corporation; LSI Corporation, Qualcomm Incorporated, GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. It has geographically diversified operational footprint of six million square feet of space located in six countries. It packages uses wirebond, flip chip and copper clip interconnect technologies and also uses leadframe and substrate package carrier. It provides semiconductor testing services including wafer testing or probe and final test. It offers a full range of test software, hardware, integration & product engineering services and supports a range of business models & test capabilities. Its marketing and sales offices are located throughout Asia, Europe and North America. It faces competition from Advanced Semiconductor Engineering, Inc., Siliconware Precision Industries Co., Ltd. and STATS ChipPAC Ltd. apart from competition from established packaging and test service providers that are located in Asia.
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