Amkor Technology Inc was formed in September 1997. The Company provides outsourced semiconductor packaging and test services. It is engaged in designing and developing new packaging and test technologies and offers a portfolio of packaging solutions and services. The Company is having a diversified operational scope with research and development, engineering and production capabilities at various facilities throughout China, Japan, Korea, the Philippines, Taiwan and the United States. The Taiwan facility has solder bumping line with HVM production capability for 200 millimeter and 300 millimeter wafers. The wafer probe testing services provides visual inspection and electrical testing of the wafer for defects prior to packaging. The Company also offers thermal controlled probe, bumped wafer probe, single and double pass probe and multi-site probe among others. The packaging and test services are designed to meet application and chip specific requirements including the type of interconnect technology employed; size; thickness and electrical, mechanical and thermal performance. The Company provides its services to integrated device manufacturers, fabless semiconductor companies and contract foundries. As of December 31, 2013 the Company had approximatley 200 customers. Some of the Company's customers are Intel Corporation; Micron Technology, Inc.; STMicroelectronics N.V.; Texas Instruments Incorporated, Toshiba Corporation, Altera Corporation; Broadcom Corporation; LSI Corporation, Qualcomm Incorporated, GlobalFoundries Inc. and Taiwan Semiconductor Manufacturing Company Limited. The Company has geographically diversified operational footprint of six million square feet of space located in six countries. The Company' packages uses wirebond, flip chip and copper clip interconnect technologies and also uses leadframe and substrate package carrier. The Company provides semiconductor testing services including wafer testing or probe and final test. It offers a full range of test software, hardware, integration and product engineering services, and supports a range of business models and test capabilities. The Company's marketing and sales offices are located throughout Asia, Europe and North America. The Company faces competition from Advanced Semiconductor Engineering, Inc., Siliconware Precision Industries Co., Ltd. and STATS ChipPAC Ltd. apart from competition from established packaging and test service providers that are located in Asia.