ASE Technology Breaks Ground On New Chip Facility In Malaysia

ASE Technology Breaks Ground On New Chip Facility In Malaysia
  • ASE Technology Holding Co, Ltd ASX hosted a groundbreaking ceremony today to construct a new semiconductor assembly and testing facility in Penang, Malaysia
  • The new facility at ASE Malaysia (ASEM) will comprise two buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
  • ASEM will invest $300 million over five years to expand its production floor space, procure advanced equipment, and train and develop more engineering talent. 
  • Also Read: Samsung Breaks Ground On R&D Complex in Giheung, Korea
  • The new facility will likely complete in 2025, creating 2,700 additional job opportunities for the local market. 
  • Together with Plants 4 and 5, ASEM will have 2 million square feet of floor space, representing a two-fold increase from the current floor space. 
  • High-demand packaging product types, including copper clip and image sensors, will be the core focus of the new facility. 
  • Green construction methods that emphasize ecological balance, conservation, and resource recycling and reuse will be adopted for the new building. 
  • ASEM will also be actively recruiting in the new year and beyond to strengthen its workforce base and contribute to the growth of semiconductor talent in Penang.
  • ASE reported a 25% year-on-year net revenue growth in Q3 to NT$188.63 billion
  • Net revenues for ATM (assembly, testing, and material) business was NT$98.8 billion, up 10% Y/Y and 4% Q/Q. 
  • EMS (electronic manufacturing services) net revenues were NT$90.66 billion, up 37% Q/Q.
  • Price Action: ASX shares traded higher by 7.89% at $5.95 on the last check Thursday.

Posted In: BriefsNewsTech