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Applied Materials, Inc.
today announced a
suite of new defect review and classification technologies for its
market-leading SEMVision^(TM) family of products to accelerate time to yield
for leading-edge chip manufacturing at 1X-nm and beyond. The Applied
SEMVision G6 defect analysis system combines unprecedented high-resolution,
multi-dimensional imaging capabilities with revolutionary machine learning
intelligence of the Purity^(TM) Automatic Defect Classification (ADC) system
that sets new performance benchmarks and brings first-of-a-kind DR SEM
technology to the semiconductor industry.
The SEMVision G6 system's resolution is a 30% improvement over the previous
generation, making it the highest available in the industry. This capability
and the system's unique e-beam tilt angle make the G6 the industry's superior,
field-proven DR SEM for finding, identifying and analyzing defects in 3D
FinFET and high aspect ratio structures at 1Xnm nodes. The system's advanced
detection assembly and sophisticated processing make possible high-quality
topographical images of tiny and shallow defects. High dynamic range
detection, collection of back-scattered electrons, and energy filtering enable
high aspect ratio imaging. High-energy imaging makes possible "see through"
penetration that reveals defects in underlying layers.
The Purity ADC's dynamic machine learning algorithms analyze and classify
defects, ensuring accuracy, quality and consistency to enable stable process
control and rapid and reliable excursion detection. Smart machine learning
algorithms also make possible the separation of real defects from the large
number of nuisance defects or false alarms, a challenge that is growing with
scaling and device complexity. By establishing a proven intelligent analysis
and classification process, Purity ADC gives customers the confidence for the
first time to rely on an automatic review system to correctly and quickly
identify classes of defects in a production environment and accelerate
time-to-yield.
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