Aehr Test Systems Announces Follow-On Order for ABTS Test System From Leading IC Manufacturer

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Aehr Test Systems
AEHR
, a worldwide supplier of semiconductor test and burn-in equipment, announced today that it has received a follow-on order for an ABTS test and burn-in system from a leading multi-national manufacturer of advanced logic integrated circuits (ICs) for automotive, embedded processing, digital signal processing and analog applications. The order includes a down payment and volume pricing discount. This system is planned to ship in the second quarter of Aehr Test's fiscal 2015. "We are extremely pleased to receive this order for an additional very high capacity production system from this customer that is in the process of ramping up production of automotive devices," said Mark Allison, vice president of sales at Aehr Test Systems. "Because of the need for extremely high reliability in automotive applications, there is a strong need for both qualification and production burn-in of these devices. Also, with decreasing geometries and increasing densities, the absolute power and variation in power is increasing, which we believe makes ABTS systems an ideal solution with their ability to dissipate up to 36kW of power and to individually control the temperature of each device. We believe that these capabilities provide the largest device capacity in the industry." The ABTS family of products is based on a new hardware and software platform that is designed to address not only today's devices, but also future devices for many years to come. It can test and burn-in both logic and memory devices, including resources for high pin-count devices and configurations for high-power and low-power applications. ABTS systems can be configured with up to 72 burn-in boards, up to 320 I/O channels, 32M of test vector memory per channel and up to 16 independent device power supplies. The ABTS system is optimized for use with the Sensata iSocket* Thermal Management Technology, which provides a scalable cost-effective solution using individual device temperature control for up to 64 devices per burn-in board and up to 75 watts per device or more. Individual temperature control enables high-power devices with a broad range of power dissipation to be burned-in simultaneously in a single burn-in chamber while maintaining a precise device temperature. The ABTS system also uses N+1 redundancy technology for many key components in the system to maximize system uptime. *iSocket is a trademark of Sensata Technologies, Inc.
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