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Camtek Ltd. (NASDAQ and TASE: CAMT), today announced that it has received
new orders from one of the world's largest OSATs. These orders will be used
for 2D and 3D inspection and metrology for Advanced Packaging semiconductor
applications.
The installation of the new systems will be complete by the end of this
quarter.
Ramy Langer, Vice President and Head of Camtek's Semiconductor Division,
commented, "These new orders validate Camtek's accumulated experience in
providing inspection and metrology for a wide range of bump types and sizes,
including next generation bumps, used in the emerging advanced packaging
market."
Continued Mr. Langer: "Selling systems to this strategic customer positions
us as a leader in both the 2D and 3D inspection and metrology spaces. Our
product line provides these two advanced capabilities on the same platform.
We are confident that we will continue to capitalize on the growth in the
advanced packaging market segment."
ABOUT CAMTEK LTD.
Camtek Ltd. provides automated and technologically advanced solutions
dedicated to enhancing production processes, increasing products yield and
reliability, enabling and supporting customer's latest technologies in the
Semiconductors, Printed Circuit Boards (PCB) and IC Substrates industries.
Camtek addresses the specific needs of these interconnected industries with
dedicated solutions based on a wide and advanced platform of technologies
including intelligent imaging, image processing and functional 3D inkjet
printing.
This press release is available at http://www.camtek.co.il
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