Disco (DSCSY) — Congressional Trading Activity

Disco is a Japan-based manufacturer of semiconductor production equipment. Founded in 1937, the company manufactures diamond, water, and laser saws, as well as grinders and polishers, used mainly in the back-end processes of semiconductor manufacturing, which involve treating processed silicon during the front-end process by thinning and dicing wafers into bare dies for packaging.It is the world's largest manufacturer of semiconductor-grade saws and grinders, with an estimated 60%-70% market share in the semiconductor dicing and grinding industry as of 2025. The company operates three main factories in Hiroshima and Nagano, Japan.