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Data as of Jan 28
Day's Range16.66 - 17.458
52 Wk Range15.89 - 29.85
50 Day Moving Avg.18.105
Semiconductor Equipment & Materials
What does this company do
Ultratech, Inc., was incorporated in the state of Delaware in 1992. The company develops, manufactures and markets photolithography and laser thermal processing equipment designed to reduce the cost of ownership for manufacturers of integrated circuits, including advanced packaging processes and various nanotechnology components, thin film head magnetic recording devices, optical networking devices, laser diodes and light emitting diodes. The company supplies step-and-repeat photolithography systems based on one-to-one imaging technology to customers located throughout North America, Europe, and Asia. Advanced packaging for integrated circuits, specifically bump or wafer level chip scale packaging techniques, require lithography steps in the device fabrication process. The company's steppers are used to manufacture high volume, low cost semiconductors used in a variety of applications such as telecommunications, automotive control systems, power systems and consumer electronics. It also supply 1X photolithography systems to thin film head manufacturers that its steppers offer advantages over certain competitive reduction lithography tools with respect to field size, throughput, specialized substrate handling and cost. Additionally, the Company supply 1X photolithography equipment to various other nanotechnology markets where certain technical features, such as high resolution at wavelengths, depth of focus and special size substrates, might offer advantages over certain competing tools. It currently offers two different series of 1X lithography systems for use in the semiconductor fabrication process: the 1000 series, which addresses the markets for high volume/low cost semiconductor fabrication and R&D packaging activities and nanotechnology applications; and the AP series, which were designed to meet the requirements in the advanced packaging market. These steppers currently offer minimum feature size capabilities ranging from 2.0 microns to 0.75 microns. For the advanced packaging market, the company offers its new AP series built on the Unity Platform. These advanced packaging systems were developed for high volume bump and wafer level CSP manufacturing and post passivation lithography applications. The AP series, consisting of the AP300 and AP200, are built on the Company's Unity Platform and feature a customer-configurable design that supports flexible manufacturing requirements as well as tool extendibility for multiple device generations. It offers an advanced laser-based thermal annealing tool, the LSA100A, built on its Unity Platform. Thermal annealing is used by the semiconductor industry for a variety of process steps, including activation of implanted impurities, dielectric film formation, and formation of silicides and stabilization of copper grain structures. The company introduced the Sapphire 100 system, and Sapphire 100E system. These systems are configurable with customized options designed specifically for high volume HBLED manufacturing applications. The Company markets and sells its products in North America, Europe, Japan, Taiwan and the rest of Asia principally through its direct sales organization. The Company's manufacturing activities consist of assembling and testing components and subassemblies, which are then integrated into finished systems. It relies on a limited number of outside suppliers and subcontractors to manufacture certain components and subassemblies.