Rambus to Speak at the 2015 Design Automation Conference (DAC)

SAN FRANCISCO--(BUSINESS WIRE)--

Rambus Inc.:

Who:					Rambus, Inc. RMBS
Where:					DAC 2015
					Moscone Convention Center
					San Francisco, CA
					Rambus participating in the ARM Connected Community booth #2414
When:					June 7 – 11, 2015

At the Design Automation Conference (DAC) 2015, the premier event for design and automation of electronic systems, Rambus will take part in multiple talks discussing low-power, high-performance memory and serial link solutions for mobile, consumer and enterprise applications. Rambus will also lead a session covering the unique requirements in designing secure chips. In addition, Rambus will be showcasing its high-performance, low-power solutions within the ARM Connected Community Pavilion. For additional details, visit www.rambus.com.

Rambus Participation at DAC:

Dates: Monday, June 8, 2015, 3:45 p.m. PDT and Tuesday, June 9, 2015, 10:45 a.m. PDT
Title: The Next Wave of Low-Power, High-Performance Mobile Memory
Focus: The increase in image capture, display resolution and frame rates continue to drive the need for more memory bandwidth and density in mobile devices. The latest high-end smartphones include LPDDR4 DRAM to deliver increased performance with reduced power consumption. This presentation will discuss advanced memory subsystems including the Rambus memory PHY with low-cost packaging, and its interface to the CoreLink DMC Memory Controller.
Speaker: Ajay Jain, director of product marketing, Rambus
Location: ARM connected Community Theater, booth# 2414

Dates: Tuesday, June 9, 2015, 2:30 p.m. PDT
Title: High-speed, Low-power Memory and Serial Links for Today's Consumer and Networking Applications
Focus: Increasing demands for mobile and cloud applications continue to drive the need for higher performance and improved power efficiency. Rambus has partnered with Samsung foundry to deliver best-in-class industry standard interfaces implemented in high-volume process technologies, providing robust solutions for a new generation of consumer and networking devices. This presentation will discuss how these market trends translate into requirements for high-speed memory and serial link interfaces and how the combination of Rambus IP and Samsung process offers considerable power and performance advantages to our mutual customers.
Speaker: Frank Ferro, senior director of product marketing, Rambus
Location: Samsung Electronics Booth, booth#933

Dates: Thursday, June 11, 2015, 4 p.m. PDT
Title: Special Session 69: The Lifecycle of Secure Chip Design
Focus: This session collects three talks that, taken together, describe the design lifecycle of a cryptographic chip. They highlight the unique requirements when designing secure chips that are subject to physical and logical threats, in particular when those chips may be physically reverse engineered.
Speaker: Megan Wachs, ASIC design engineering, Rambus Cryptography Research Division
Location: Room #300

Follow Rambus
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.

Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer's products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

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