Lattice Semiconductor Demonstrates Comprehensive Industrial Interface Solutions at Embedded World 2015

HILLSBORO, Ore.--(BUSINESS WIRE)--

Lattice Semiconductor Corporation LSCC, the leader in ultra-low power, small form factor, customizable solutions, today announced that it will be unveiling new programmable industrial automation solutions focused on vision, video and display and real-world industrial bridging and interface solutions.

Embedded World runs February 24-26, at the Exhibition Centre, Nuremberg (Nürnberg Messe), Germany. Lattice is exhibiting on booth 4A 424 featuring a variety of solutions enabled by Lattice ECP5™,MachXO3L™ and iCE40™ devices.

Industrial Automation:

• Industrial control:
  • USB Type C Customizable Power Delivery and Cable Detect
  • Machine Vision (USB3 Vision)
  • Motor Control and fieldbus (SERCOS III, REDBUS)
• Video and Imaging:
  • Camera (sensor bridging, ISP, WDR)
  • Display (4K , Video Wall)

Lattice will also announce the availability of its latest FPGA-based functional safety offering in conjunction with TUV-certified IEC61508 design flow and functional safety data packages for IEC61508 which will enable the company to better support customers in safety-critical industrial and automotive applications.

About Lattice Semiconductor

Lattice Semiconductor LSCC is the leader in low power, small form factor, low cost, customizable solutions for a quickly changing connected world. From making smart consumer devices smarter, to enabling intelligent industrial automation, or connecting anything to everything in communications, electronics manufacturers around the world use Lattice's solutions for fast time to market, product innovation, and competitive differentiation. For more information, visit www.latticesemi.com. You can also follow us via LinkedIn, Twitter, Facebook or RSS.

Lattice Semiconductor Corporation, Lattice Semiconductor (& design), L (& design), ECP5, MachXO3L, ICE40 and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.