Camtek Receives Multiple Orders for the Inspection of Fan-Out Packaging Applications

Camtek Ltd. CAMT, today announced that a leading OSAT (Outsourced Semiconductor Assembly and Test) placed multiple orders for inspection and metrology systems. These orders will be delivered and installed during the first and second quarters of 2016. The equipment will be used for the inspection and metrology of Wafer Level Packaging Fan-Out (WLFO) applications for the advanced packaging market. WLFO technologies provide unique and innovative extensions into advanced packaging, by providing increased input/output densities within a reduced footprint. This provides substantially improved working efficiencies and lowers chip costs. Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, "I am pleased our market-leading systems were again chosen for these fan-out applications. Camtek has unparalleled special inspection capabilities which are supporting the emerging WLFO technologies." Continued Mr. Langer: "While 2015 was a great year for us, as these new orders demonstrate, in 2016 we are continuing to gain further market share as we support our customers' growth in the advanced packaging market."