Aehr Test Systems Announces First Order for New FOX-XP(TM) Wafer Level Test and Burn-in System

Aehr Test Systems AEHR, a worldwide supplier of semiconductor test and burn-in equipment, today announced the company has received its first order for its FOX-XP Wafer Level Test and Burn-in System including multiple FOX-XP WaferPak Contactors and application development services. Gayn Erickson, President and CEO of Aehr Test Systems, commented, "We are very excited to announce our first order for our new FOX-XP test and burn-in system. This first FOX-XP engineering system and several WaferPak Contactors will be used for reliability and qualification test of devices intended for a very high volume application. We believe this initial order represents a significant new opportunity for our FOX-XP multi-wafer production system as this device moves into high volume manufacturing with wafer level burn-in. The FOX-XP system was purchased for this application due to the significant number of resources and power capability that this system and our FOX WaferPak Contactors are capable of handling." Aehr Test's FOX-XP system is the company's next-generation multi-wafer test solution that is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other leading-edge ICs in wafer form before they are assembled into single or multi-die stacked packages or for non-packaged die sales or applications where known good die is critical. These singulated die or single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The FOX-XP system utilizes Aehr Test's FOX WaferPak contactor, which provides a cost effective solution for making electrical contact with a full wafer or substrate in a multi-wafer environment. Aehr Test's WaferPak contactors contain up to tens of thousands of probes to contact all devices on wafers and substrates up to 300mm simultaneously. The FOX-XP system is being developed in configurations up to 25 wafers in parallel in a single system to operate within an efficient manufacturing space footprint. Aehr Test estimates the test equipment and consumables for the emerging multi-wafer level test and burn-in market will add $200 million to $300 million to its served available market.