Aehr Test Systems Announces Shipment of FOX-15(TM) Multi-Wafer Burn-In System for Production Test & Burn-In Application

Aehr Test Systems AEHR, a worldwide supplier of semiconductor test and burn-in equipment, today announced that it has shipped the FOX-15 Multi-Wafer Test and Burn-In System, the WaferPak Aligner and the first batch of WaferPak™ contactors for the production test and burn-in order announced on April 27th, 2015. The shipment occurred in the first quarter of Aehr Test's fiscal 2016, which closed on August 31, 2015. The remaining WaferPak contactors included in the order are expected to ship in the second quarter of Aehr Test's fiscal 2016. "We are very excited to have delivered this initial FOX-15 test cell to this major new customer," said Gayn Erickson, President and CEO of Aehr Test Systems. "This production customer is extremely quality and cost conscious, which makes them a great match for the reliability and yield improvements that our wafer level burn-in and test solutions provide. We were able to respond to the customer's request for earlier shipment than originally committed, and we will be providing extensive on-site installation and qualification support to ensure a smooth transition to production. "This new customer's production application is further evidence of the significant opportunity ahead for Aehr Test's unique and highly cost effective wafer level test and burn-in solution within the rapidly growing consumer, mobile, automotive, and computing markets. With the solid backlog we reported at the end of our fiscal year and subsequent orders we have received to date, we continue to expect to deliver significant revenue growth this fiscal year as we execute on these orders, and look forward to reporting much healthier and stronger financial results for fiscal 2016." Aehr Test's FOX family of products is focused on high reliability test needs and long-duration full wafer burn-in and test of products such as sensors, automotive ICs, discrete memories, and devices with embedded memories including microcontrollers and smart card devices. The FOX-1 and FOX-1P systems offer high-throughput single-touchdown sort testing. The FOX-15 system has a capacity of up to 15 WaferPak single-touchdown full wafer contactors for burn-in and test of state-of-the-art integrated circuits and sensors. Testing the ICs in wafer form before they are assembled into multi-die stacked packages enables the stacked packages to then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, mission critical integrated circuits and sensors. Aehr Test's recently-introduced FOX-1P system extends the capabilities of its FOX-1 system by adding high density, low cost I/O and DPS modules with the capability to provide over 16,000 I/O or DPS channels in a single test head for massive parallelism on a single wafer.