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Industry Sources Report Advanced Semiconductor Engineering to Team Up with Micron to Set Up Joint Packaging and Testing Fab in Xian, China -Digitimes

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Micron (NYSE: MU) is currently producing standard DRAM chips from its Malaysia plant, but Plans to switch over to NAND flash production, according to Digitimes. The change will require Micron to outsource packaging capacity, including setting up a joint packaging and testing fab with Advanced Semiconductor Engineering (NYSE: ASX) in Xian, China, according to sources.

View full article http://www.digitimes.com/news/a20140318PD217.html

Posted-In: DigitimesNews Rumors Global Tech

 

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