Rubicon Technology, Inc. RBCN, a leading provider of sapphire
substrates and products to the LED, semiconductor, and optical industries,
today announced that the United States Patent and Trademark Office (USPTO) has
allowed Rubicon's patent application entitled, “Ultra-Flat, High-Throughput
Wafer Lapping Process.” The patent covers Rubicon's process developed to
perform grinding and polishing to achieve consistent, ultra-flat and
defect-free surface quality for the high-volume production of large diameter
sapphire wafers.
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