Rubicon Says Patent Allowed for Ultra-Flat, High-Throughput Wafer Lapping
Rubicon Technology, Inc. (NASDAQ: RBCN), a leading provider of sapphire substrates and products to the LED, semiconductor, and optical industries, today announced that the United States Patent and Trademark Office (USPTO) has allowed Rubicon's patent application entitled, “Ultra-Flat, High-Throughput Wafer Lapping Process.” The patent covers Rubicon's process developed to perform grinding and polishing to achieve consistent, ultra-flat and defect-free surface quality for the high-volume production of large diameter sapphire wafers.
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