Market Overview

Hoku Says Liens Have Been Filed Against Hoku Materials, Has Substantially Reduced Construction Activities

Related HOKU
NASDAQ Halts Hoku Corporation
From Earlier: Hoku's Board of Directors Forms Restructuring Committee

The Company confirmed that it had substantially reduced construction activities at the polysilicon production facility of Hoku Materials, its subsidiary, in December 2011, and by April 2012, all construction contractors had stopped work. The facility is not yet in commercial operation.

The Company announced that as of March 31, 2012, its preliminary estimates of cash, other current assets and current liabilities was approximately $7.7 million, $6.7 million, and $278.8 million, respectively. The current liabilities include approximately $74.4 million of accounts payable at Hoku Materials. Due to the delinquency of unpaid construction obligations, liens have been filed against the Hoku Materials polysilicon plant, and some lienholders have begun foreclosure proceedings in the Idaho courts.

Posted-In: News

 

Related Articles (HOKU)

Around the Web, We're Loving...

Get Benzinga's Newsletters