Rubicon Says Patent Allowed for Ultra-Flat, High-Throughput Wafer Lapping - Rubicon Technology (OTC:RBCN)

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Rubicon Technology, Inc. (NASDAQ: RBCN), a leading provider of sapphiresubstrates and products to the LED, semiconductor, and optical industries,today announced that the United States Patent and Trademark Office (USPTO) hasallowed Rubicon's patent application entitled, “Ultra-Flat, High-ThroughputWafer Lapping Process.” The patent covers Rubicon's process developed toperform grinding and polishing to achieve consistent, ultra-flat anddefect-free surface quality for the high-volume production of large diametersapphire wafers.

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