Market Overview

Worldwide Fan-out Wafer Level Packaging Industry to 2024 - Increased Demand for Compactly Designed Electronics is Driving Growth - ResearchAndMarkets.com

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The "Global Fan-out Wafer Level Packaging Market 2020-2024" report has been added to ResearchAndMarkets.com's offering.

The fan-out wafer level packaging market is poised to grow by $ 1.94 billion during 2020-2024 progressing at a CAGR of 16% during the forecast period.

The report on the fan-out wafer level packaging market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.

The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The market is driven by the increased demand for compactly designed electronics, and rapid adoption of FinFET technology.

The fan-out wafer level packaging market analysis includes technology segment an d geographic landscapes. This study identifies the growing use of semiconductor ICs in IoT as one of the prime reasons driving the fan-out wafer level packaging market growth during the next few years.

This report presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters.

Companies Mentioned

  • Amkor Technology Inc.
  • ASE Technology Holding Co. Ltd.
  • Cypress Semiconductor Corp.
  • Infineon Technologies AG
  • JCET Group Co. Ltd.
  • NXP Semiconductors NV
  • Renesas Electronics Corp.
  • Samsung Electronics Co. Ltd.
  • Siliconware Precision Industries Co. Ltd.
  • Taiwan Semiconductor
  • Manufacturing Co. Ltd.

The fan-out wafer level packaging market covers the following areas:

  • Fan-out wafer level packaging market sizing
  • Fan-out wafer level packaging market forecast
  • Fan-out wafer level packaging market industry analysis

Key Topics Covered:

1. Executive Summary

  • Market Overview

2. Market Landscape

  • Market ecosystem
  • Value chain analysis

3. Market Sizing

  • Market definition
  • Market segment analysis
  • Market size 2019
  • Market outlook: Forecast for 2019 - 2024

4. Five Forces Analysis

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

5. Market Segmentation by Technology

  • Market segments
  • Comparison by Technology
  • High density - Market size and forecast 2019-2024
  • Standard density - Market size and forecast 2019-2024
  • Market opportunity by Technology

6. Customer landscape

  • Overview

7. Geographic Landscape

  • Geographic segmentation
  • Geographic comparison
  • APAC - Market size and forecast 2019-2024
  • North America - Market size and forecast 2019-2024
  • Europe - Market size and forecast 2019-2024
  • South America - Market size and forecast 2019-2024
  • MEA - Market size and forecast 2019-2024
  • Key leading countries
  • Market opportunity by geography

8. Drivers, Challenges, and Trends

  • Market drivers
  • Volume driver - Demand led growth
  • Volume driver - Supply led growth
  • Volume driver - External factors
  • Volume driver - Demand shift in adjacent markets
  • Price driver - Inflation
  • Price driver - Shift from lower to higher priced units
  • Market challenges
  • Market trends

9. Vendor Landscape

  • Overview
  • Landscape disruption

10. Vendor Analysis

  • Vendors covered
  • Market positioning of vendors

11. Appendix

  • Scope of the report
  • Currency conversion rates for US$
  • Research methodology
  • List of abbreviations

For more information about this report visit https://www.researchandmarkets.com/r/qt42jz

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