2020 Nokia 4G AirScale BBU Teardown Report - AMIA Subrack, ASIA Common Plug In Unit, and ABIA Capacity Plug In Unit

Dublin, May 20, 2020 (GLOBE NEWSWIRE) -- The "Nokia 4G AirScale BBU" report from EJL Wireless Research has been added to ResearchAndMarkets.com's offering.

This report provides a comprehensive analysis of the Nokia Networks 4G AirScale Digital Baseband Unit (BBU). The configuration of the 4G AirScale is:

• AMIA Subrack
• ASIA Common Plug In Unit
• ABIA Capacity Plug In Unit

Features

• System Functional Description
• System Level Block Diagrams
• High Level Mechanical Analysis
  • Heat Sink
• High Level PCB Analysis
• Component Diagrams
  • Semiconductor/component locations on PCB
• High Level Bill of Materials
  • Semiconductor ICs (ASICs, FPGAs, memory, logic, power, etc.)
  • Passive/other components (Transformers, Power inductors, Power capacitors, power/datacom/optical connectors)
  • Complete Part Number/Marking
  • Component Manufacturer Identification
  • Function Component Description
  • Package Type
• Excludes analysis of low power passive chip resistors, capacitors, and inductors

Key Topics Covered

EXECUTIVE SUMMARY

• Active/Passive Component Summary

CHAPTER 1: NOKIA AIRSCALE SYSTEM MODULE

• Overview of AirScale BTS Portfolio

CHAPTER 2: AMIA SUBRACK

• AMIA Guiderails
• ASIx Blind Slot Frame
• ABIx Blind Slot Frame
• AMIA Chassis: External Views and Dimensions
• AMIA Chassis: Backplane and Fan Units
• AMIA Backplane

CHAPTER 3: ASIA PLUG IN UNIT

• ASIA Front Panel & Handles
• Power Supply Unit (PSU)
• PSU Top Cover Heatsink
• PSU Bottom FCTJ Heatsink
• PSU Printed Circuit Board Analysis
• PSU Input DC Voltage Connector Assembly
• PSU DC Busbar Assembly
• ASIA FCTJ PCB
• eUSB Flash Card
• OCXO Module
• ASIA FCTJ Bottom Cover

CHAPTER 4: ABIA

• ABIA Front Panel
• ABIA FSPJ Heatsink
• ABIA FSPJ Cover
• ABIA FSPJ PCB

For more information about this report visit https://www.researchandmarkets.com/r/jkeuj9

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