Market Overview

Semiconductor Industry: KYOCERA and Vicor to Collaborate on Advanced Power-on-Package Solutions

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Collaboration will maximize AI performance and minimize
time-to-market for new processor designs

Kyocera Corporation (TYO:6971) and Vicor Corporation (NASDAQ:VICR)
will collaborate on next-generation Power-on-Package solutions to
maximize performance and minimize time-to-market for emerging processor
technologies, the companies announced today. As a part of the
collaboration between the two technology leaders, Kyocera will provide
the integration of power and data delivery to the processor with organic
packages, module substrates and motherboard designs. Vicor will provide
Power-on-Package current multipliers enabling high density, high current
delivery to processors. This collaboration will address the rapid growth
of higher performing processors, which has created proportionate growth
and complexity in high-speed I/Os and high current consumption demands.

This press release features multimedia. View the full release here:
https://www.businesswire.com/news/home/20190410005370/en/

Vicor's Power-on-Package technology enables current multiplication
within the processor package, allowing for higher efficiency, density,
and bandwidth. Providing current multiplication within the package can
reduce interconnect losses by up to 90 percent, while allowing processor
package pins, typically required for high current delivery, to be
reclaimed for expanded I/O functionality. Vicor's Power-on-Package
solutions were featured at the NVIDIA GPU Technology Conference 2018 and
China ODCC 2018 Summit. Vicor's advanced Power-on-Package technology
enables Vertical Power Delivery (VPD) from the bottom side of the
processor. VPD virtually eliminates Power Delivery Network (PDN) losses
while maximizing I/O capability and design flexibility.

Kyocera's proprietary solutions to optimize processor performance and
reliability are based on decades of experience in package, module and
motherboard manufacturing for customers worldwide. Kyocera has
cultivated design expertise by applying Vicor's Power-on-Package devices
in multiple applications. By utilizing its design technology, simulation
tools and manufacturing experience, Kyocera provides optimal designs for
complex I/O routing, high speed memory routing, and high-current power
delivery. Through collaboration, Kyocera and Vicor will bring new
solutions for AI and high-performance processor applications to market.

About
KYOCERA

Kyocera
Corporation
(TYO:6971) (https://global.kyocera.com/),
the parent and global headquarters of the Kyocera Group, was founded in
1959 as a producer of fine
ceramics
(also known as "advanced ceramics"). By combining these
engineered materials with metals and integrating them with other
technologies, Kyocera has become a leading supplier of semiconductor
packages, industrial and automotive components, electronic devices,
solar power generating systems, printers, copiers and mobile phones.
During the year ended March 31, 2018, the company's consolidated net
sales totaled 1.58 trillion yen (approx. USD14.9 billion). Kyocera
appears on the "Derwent Top 100 Global Innovators 2018-19" list by
Clarivate Analytics and is ranked #612 on Forbes magazine's 2018 "Global
2000" list of the world's largest publicly traded companies.

About
Vicor

Vicor
Corporation
(NASDAQ:VICR) (http://www.vicorpower.com)
designs, develops, manufactures and markets modular power components and
complete power systems based upon a portfolio of patented technologies.
Headquartered in Andover, Massachusetts, Vicor sells its products to the
power systems market, including enterprise and high-performance
computing, industrial equipment and automation, telecommunications and
network infrastructure, vehicles and transportation, aerospace and
defense. www.vicorpower.com

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