Market Overview

Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology



  • Computing industry leaders collaborate in delivery of the
    industry's first development platform for 7nm Arm Neoverse N1 SoCs and
    CCIX interconnect architecture
  • Platform includes a 2.6-3GHz Neoverse N1 SoC implemented and
    verified using a full Cadence tool flow in TSMC 7nm FinFET process
    technology and connectivity to Xilinx FPGAs via CCIX

Arm, Cadence Design Systems, Inc. (NASDAQ:CDNS) and Xilinx, Inc.
(NASDAQ:XLNX) today announced the delivery of a new development
platform, silicon-proven on TSMC's ((TWSE: 2330, NYSE:TSM) 7nm FinFET
process technology, for next-generation cloud-to-edge infrastructure
based on the new Arm® Neoverse N1 platform. The
Neoverse N1 System Development Platform (SDP) is also the industry's
first 7nm infrastructure development platform enabling asymmetrical
compute acceleration via the CCIX
interconnect architecture
and is available to hardware and software
developers for hardware prototyping, software development, system
validation, and performance profiling/tuning.

The SDP includes a Neoverse N1-based SoC with an operating frequency of
up to 3GHz, full-sized caches and generous amounts of memory bandwidth
with the latest optimized system IP. The robustness of the SDP is ideal
for development, debug, performance optimization and workload analysis
on a wide range of applications including those for machine learning
(ML), artificial intelligence (AI) and data analytics.

The Neoverse N1 SDP was developed jointly by Arm, Cadence and Xilinx on
TSMC's process technology, and includes Cadence IP for CCIX, PCI Express®
(PCIe®) Gen 4 and DDR4 PHY IP. The SDP was implemented and
verified using a full Cadence tool flow in TSMC's 7nm FinFET process
technology, the industry's first and leading 7nm process technology in
volume production, and provides connectivity to Xilinx Virtex
UltraScale+ FPGAs over the CCIX chip-to-chip coherent interconnect
protocol via the Xilinx Alveo U280 CCIX accelerator card. For customers
with intense compute workloads, CCIX offers a significant accelerator
usability improvement as well as improved data center
performance/efficiency, lowering the barrier to entry into existing
server infrastructure systems and improving the total cost of ownership
(TCO) of acceleration systems.


The Neoverse N1 SDP will be available in limited quantities in Q2 2019
with wider availability in subsequent quarters. The software stack can
be accessed through Linaro and GitHub open-source repositories,
providing developers with an out-of-the-box Linux software experience.
The Xilinx Alveo U280 accelerator card, which features a
high-performance FPGA with integrated high-bandwidth memory (HBM) and a
CCIX interface, is available now and can be purchased directly
from Xilinx
. Additionally, the full Cadence SoC implementation and
verification flows, CCIX, PCIe Gen 4 and DDR4 IP, and the Neoverse N1
Rapid Adoption Kit (RAK) are available now, so customers can begin
designing Neoverse N1-based SoCs on TSMC's 7nm silicon immediately. For
more information on the Neoverse N1 SDP, please visit

Partner Quotes

"The new Neoverse platforms deliver the performance and efficiency
required to enable the cloud-to-edge infrastructure for a world with a
trillion connected devices. Our ongoing SDP collaboration with Cadence,
TSMC, and Xilinx truly enables developers with the system development
tools necessary to innovate and deliver optimized Neoverse-based
-Drew Henry, senior vice president and general
manager, Infrastructure Line of Business, Arm

"Through our collaboration with Arm, TSMC and Xilinx, we are jointly
working to advance next-generation cloud-to-edge infrastructure. By
contributing our IP and EDA tools and flows to the development of the
Neoverse N1 SDP, we're enabling customers to use the full Cadence
implementation and verification flows, infrastructure IP, and rapid
adoption kit to develop their own devices today for machine learning,
5G, analytics and other evolving application areas that enable them to
excel in their respective markets."
-Dr. Anirudh Devgan,
president, Cadence

"This collaborative effort combines Arm, Cadence and Xilinx's leading
products, IP and tools with TSMC's 7nm FinFET process technology and
foundry services, enabling our customers to achieve faster and
successful application development in areas including machine
learning/AI, 5G and analytics, and creating greater value to the markets
that will be fundamentally transformed by those applications."
Cliff Hou, VP Technology Development, TSMC

"The ARM Neoverse N1 CCIX-enabled SDP with the Alveo accelerator card is
a highly-performant platform designed to enable the next generation of
applications to be developed. The seamless data-sharing among the
heterogeneous devices demonstrates the successful integration of CCIX IP
from multiple vendors and the expanding reach of CCIX technology."
Singh, corporate vice president, Silicon Architecture and Verification,

About Arm

Arm technology is at the heart of a computing and connectivity
revolution that is transforming the way people live and businesses
operate. Our advanced, energy-efficient processor designs have enabled
intelligent computing in more than 130 billion chips. More than 70% of
the world's population are using Arm technology, which is securely
powering products from the sensor to the smartphone to the
supercomputer. This technology combined with our IoT software and
end-to-end connectivity, device and data management platform enables
customers to derive real business value from their connected devices and
data. Together with our 1,000+ technology partners we are at the
forefront of designing, securing and managing all areas of compute from
the chip to the cloud.

About Cadence

Cadence enables electronic systems and semiconductor companies to create
the innovative end products that are transforming the way people live,
work and play. Cadence's software, hardware and semiconductor IP are
used by customers to deliver products to market faster. The company's
System Design Enablement strategy helps customers develop differentiated
products—from chips to boards to systems—in mobile, consumer, cloud
datacenter, automotive, aerospace, IoT, industrial and other market
segments. Cadence is listed as one of Fortune Magazine's 100 Best
Companies to Work For. Learn more at

About TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing
the industry's leading process technology and the foundry segment's
largest portfolio of process-proven libraries, IPs, design tools and
reference flows. The Company's owned capacity in 2019 is expected to
reach above 12 million (12-inch equivalent) wafers, including capacity
from three advanced 12-inch GIGAFAB® facilities, four eight-inch fabs,
one six-inch fab, as well as TSMC's wholly owned subsidiaries,
WaferTech, TSMC China, and TSMC Nanjing. TSMC is the first foundry to
provide 7-nanometer production capabilities. Its corporate headquarters
are in Hsinchu, Taiwan. For more information about TSMC please visit

About Xilinx

Xilinx develops highly flexible and adaptive processing platforms that
enable rapid innovation across a variety of technologies – from the
endpoint to the edge to the cloud. Xilinx is the inventor of the FPGA,
hardware programmable SoCs and the ACAP, designed to deliver the most
dynamic processor technology in the industry and enable the adaptable,
intelligent and connected world of the future. For more information,

© 2019 Cadence Design Systems, Inc. All rights reserved worldwide.
Cadence, the Cadence logo and the other Cadence marks found at
are trademarks or registered trademarks of Cadence Design Systems, Inc.
Arm and Neoverse are registered trademarks or trademarks of Arm Limited
(or its subsidiaries) in the US and/or elsewhere. PCI Express and PCIe
are registered trademarks or trademarks of PCI-SIG. All other trademarks
are the property of their respective owners.

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