Market Overview

Global Atomic Layer Deposition Market 2018-2022 - High Demand for NAND Storage / High Cost of ALD Systems / Competitive Landscape - ResearchAndMarkets.com

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The "Global
Atomic Layer Deposition Market 2018-2022"
report has been added
to ResearchAndMarkets.com's offering.

The market research analysts have predicted that the atomic layer
deposition market will register a CAGR of almost 13% by 2022.

The new technologies such as 3D NAND storage are being developed with
the growing demand for NAND storage. 3D NAND storage provides higher
storage capacity due to multi-storeyed stacking of layers of memory
structures. Therefore, atomic layer deposition (ALD) systems helps in
manufacturing 3D NAND as it allows the deposition of several controlled
and precise layers on the substrate which gives it a stacked structure
and thereby increases its storage capacity. Hence, ALD is used to create
di-electric films for 3D NAND systems, the increasing demand for NAND
storage will drive the atomic layer deposition market growth.

Market Overview

High demand for NAND storage

The high degree of process control required in developing 3D NAND memory
systems, ALD is extensively employed to create di- electric films the 3D
NAND systems. Therefore, the increasing demand of 3D NAND memory
systems, the market will grow during the forecast period.

High cost of ALD systems

Due to high cost of ALD, the vendors in the market providing ALD systems
have also reduced their investments in ALD technology. This had led the
semiconductor manufacturers can use substitutes like CVD systems with
lower costs compared with ALD systems.

Competitive Landscape

The global atomic layer deposition market is highly concentrated with
the presence of few established companies competing for the market
share. This market research report will help clients identify new growth
opportunities and design unique growth strategies by providing a
comprehensive analysis of the markets competitive landscape and offering
information on the products offered by companies.

Key Topics Covered:

PART 01: EXECUTIVE SUMMARY

PART 02: SCOPE OF THE REPORT

PART 03: RESEARCH METHODOLOGY

PART 04: MARKET LANDSCAPE

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

PART 05: MARKET SIZING

  • Market definition
  • Market sizing 2017
  • Market size and forecast 2017-2022

PART 06: FIVE FORCES ANALYSIS

  • Bargaining power of buyers
  • Bargaining power of suppliers
  • Threat of new entrants
  • Threat of substitutes
  • Threat of rivalry
  • Market condition

PART 07: CUSTOMER LANDSCAPE

PART 08: SEGMENTATION BY APPLICATION

  • Segmentation by application
  • Comparison by Application
  • Memory
  • Logic devices
  • MEMS and other semiconductors
  • Market opportunity by Application

PART 09: REGIONAL LANDSCAPE

  • Geographical segmentation
  • Regional comparison
  • Key leading countries
  • Market opportunity

PART 10: DECISION FRAMEWORK

PART 11: DRIVERS AND CHALLENGES

PART 12: MARKET TRENDS

  • Focus on increasing wafer sizes
  • Development of area selected ALD
  • Increasing use of ALD in electric vehicles

PART 13: VENDOR LANDSCAPE

  • Landscape disruption
  • Competitive scenario

PART 14: VENDOR ANALYSIS

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Applied Materials
  • ASM International
  • Beneq
  • Lam Research
  • Tokyo Electron

For more information about this report visit https://www.researchandmarkets.com/research/dl9mlj/global_atomic?w=4

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