Market Overview

PEI Introduces Photoetched Microelectronic Lids, Covers, RF Absorbers & Getters

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Photofabrication Engineering, Inc. (PEI) has introduced a wide range of standard and custom chemically machined, tight tolerance lids and covers designed for seam-weldable hybrid microelectronic packaging.

MILFORD, Mass/ (PRWEB) September 05, 2018

Photofabrication Engineering, Inc. (PEI) has introduced a wide range of standard and custom chemically machined, tight tolerance lids and covers designed for seam-weldable microelectronic.

PEI Step or Flat Lids & Covers are chemically machined (photo etched) from a variety of alloys such as Kovar® iron-nickel-cobalt per MIL-I-20311C, Class 1 (ASTM F-15); offered with logos, part numbers and serialization. Designed for seam-weldable hybrid microelectronic packaging, they can incorporate RF absorbers and hydrogen & moisture Getters attached to the lid interior.

Featuring an improved etch design that creates a better fillet of plating between the package and lid, PEI Step or Flat Lids & Covers can include various plating and finishing options such as Gold plate per MIL-DTL-45204, electrolytic nickel per QQ-N-290, and electro-less nickel per MIL-C-26074. Sizes can range from 0.15" up and eliminate mechanical stresses or tabs.

PEI Step or Flat Lids & Covers are priced according to configuration and volume. A tooling library exists for hundreds of standard hybrid package designs. The firm is ISO-9001:2015 and AS9100:2016 certified and ITAR registered.

For more information contact:

Photofabrication Engineering, Inc.
Robert D. Ashman, National Sales Manager
500 Fortune Blvd.
Milford, MA 01757
(508) 478-2025 FAX (508) 478-3582
e-mail: rashman@photofabrication.com
http://www.photofabrication.com

For the original version on PRWeb visit: https://www.prweb.com/releases/pei_introduces_photoetched_microelectronic_lids_covers_rf_absorbers_getters/prweb15732618.htm

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