Market Overview

ASE Technology Holding Named Industry Leader in the 2018 Dow Jones Sustainability Indices


The company is recognized for a third year in a row on the iconic
annual global sustainability performance index

ASE Technology Holding Co., Ltd. ((TAIEX: 3711, NYSE:ASX), the leading
provider of semiconductor packaging, test and system assembly services,
today announced that it has been included in the 2018 Dow Jones
Sustainability Indices (DJSI) World and Emerging Market segments. This
will also be the third year in a row that the company has been selected
as the Industry leader in the Semiconductors and Semiconductor Equipment
Industry Group. Its predecessor, Advanced Semiconductor Engineering Inc.
was selected as industry leader in 2016 and 2017 respectively.

ASE Technology Holding was among 2,500 largest companies of the S&P
Global Broad Market Index selected in the annual DJSI World assessment.
Additionally, out of 55 companies assessed in the Semiconductors and
Semiconductor Industry segment, only 6 of the companies including ASE
Technology Holding made the cut on the DJSI World list.

"It is truly an honor to be included on the DJSI annual list in an
industry that is so highly competitive," said Jason Chang, Chairman of
ASE Technology Holding. "Going forward, we will continue our
sustainability efforts through pragmatic, honest and responsible
practices that will create positive impact on both industry and
society," he continued.

Launched in 1999, the DJSI were the first global indices tracking
the financial performance of leading sustainability-driven companies
worldwide based on RobecoSAM's analysis of financially material
Environmental, Social, and Governance (ESG) factors and S&P DJI's robust
index methodology. For more information, please visit

For more information on ASE Technology Holding Co., Ltd.'s corporate
sustainability, please visit

About ASE Technology Holding Co., Ltd.

ASE Technology Holding Co., Ltd. is among the leading providers of
independent semiconductor manufacturing services in assembly, test,
materials and design manufacturing. As a global leader geared towards
meeting the industry's ever growing needs for faster, smaller and higher
performance chips, ASE Technology Holding develops and offers a wide
portfolio of technology and solutions including IC test program design,
front-end engineering test, wafer probe, wafer bump, substrate design
and supply, wafer level package, flip chip, system-in-package, final
test and electronic manufacturing services. For more information about
ASE Technology Holding, visit

Safe Harbor Notice

This press release contains "forward-looking statements" within the
meaning of Section 27A of the United States Securities Act of 1933, as
amended, and Section 21E of the United States Securities Exchange Act of
1934, as amended. Although these forward-looking statements, which may
include statements regarding our future results of operations, financial
condition or business prospects, are based on our own information and
information from other sources we believe to be reliable, you should not
place undue reliance on these forward-looking statements, which apply
only as of the date of this press release. The words "anticipate,"
"believe," "estimate," "expect," "intend," "plan" and similar
expressions, as they relate to us, are intended to identify these
forward-looking statements in this press release. Our actual results of
operations, financial condition or business prospects may differ
materially from those expressed or implied in these forward-looking
statements for a variety of reasons, including risks associated with
cyclicality and market conditions in the semiconductor or electronic
industry; changes in our regulatory environment, including our ability
to comply with new or stricter environmental regulations and to resolve
environmental liabilities; demand for the outsourced semiconductor
packaging, testing and electronic manufacturing services we offer and
for such outsourced services generally; the highly competitive
semiconductor or manufacturing industry we are involved in; our ability
to introduce new technologies in order to remain competitive;
international business activities; our business strategy; our future
expansion plans and capital expenditures; the strained relationship
between the Republic of China and the People's Republic of China;
general economic and political conditions; the recent global economic
crisis; possible disruptions in commercial activities caused by natural
or human-induced disasters; fluctuations in foreign currency exchange
rates; and other factors. For a discussion of these risks and other
factors, please see the documents we file from time to time with the
Securities and Exchange Commission, including the 2017 Annual Report on
Form 20-F for our predecessor company, Advanced Semiconductor
Engineering, Inc., filed on March 28, 2018.

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