Market Overview

CyberOptics Receives $2.75 Million of Orders for Memory Module Inspection Systems

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CyberOptics® Corporation (NASDAQ:CYBE), a leading global developer and
manufacturer of high precision 3D sensing technology solutions, today
announced that it has received orders valued at approximately $2.75
million for MX600 memory module inspection systems. The orders were
received from the same customer who previously purchased the MX600.

Based on current material lead times, the Company presently anticipates
that revenue from these orders will be recognized in the first half of
2019. The Company will provide updates regarding the potential timing of
revenue recognition as the year progresses.

About CyberOptics

CyberOptics Corporation (www.cyberoptics.com)
is a leading global developer and manufacturer of high precision sensing
technology solutions. CyberOptics' sensors are used in SMT,
semiconductor and metrology markets to significantly improve yields and
productivity. By leveraging its leading edge technologies, the company
has strategically established itself as a global leader in high
precision 3D sensors, allowing CyberOptics to further increase its
penetration of key vertical markets. Headquartered in Minneapolis,
Minnesota, CyberOptics conducts worldwide operations through its
facilities in North America, Asia and Europe.

 
Statements regarding the company's anticipated performance are
forward-looking and therefore involve risks and uncertainties,
including but not limited to: market conditions in the global SMT
and semiconductor capital equipment industries; the timing of orders
and shipments of our products, particularly our 3D MRS-enabled AOI
systems; increasing price competition and price pressure on our
product sales, particularly our SMT systems; the level of orders
from our OEM customers; the availability of parts required to meet
customer orders; unanticipated product development challenges; the
effect of world events on our sales, the majority of which are from
foreign customers; rapid changes in technology in the electronics
markets; product introductions and pricing by our competitors; the
success of our 3D technology initiatives; the market acceptance of
our SQ3000 3D CMM system, mid-end semiconductor inspection sensors
and CyberGage360 product; costly and time consuming litigation with
third parties related to intellectual property infringement; and
other factors set forth in the company's filings with the Securities
and Exchange Commission.
 

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