Market Overview

Complete Teardown Report of Hamamatsu's C12880MA Micro-Spectrometer - Comparison with NanoLambda NSP32 and Consumer Physics SCiO Spectrometers


Dublin, Aug. 29, 2018 (GLOBE NEWSWIRE) -- The "Hamamatsu C12880MA Micro-Spectrometer Complete Teardown Report" report has been added to's offering.

This report contains a detailed physical analysis with process description and manufacturing cost analysis. It also includes a full comparison with the NanoLambda NSP32 and Consumer Physics SCiO spectrometers.

For a long time, spectral analysis of materials has been reserved for academic research laboratories. The arrival of new small and cheap sensors allows their integration into new products and industrial environments to increase the quality of production and product control.

The spectrum data measured by the Hamamatsu C12880MA micro-spectrometer is compatible with the spectrum data measured by conventional optical spectrum analyzers, which facilitates the use of this device without needing to create a database.

The C12880MA is a 2.5cm3 spectrometer head that could be integrated into a wide range of measurement and quality control equipment. Working with wavelengths between UV and near IR, 340-850nm, the micro-spectrometer can be used for food inspection, biometry, water quality, light testing and light level measurements.

The CMOS linear image sensor provides spectral resolution of 15nm. Moreover, the hermetic package allows its use in moist atmosphere. The small package integrates the light sensor and diffractive elements, here a reflective grating and slit.

Key Topics Covered:

1. Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

2. Company Profile

  • Hamamatsu Photonics
  • C12880MA Characteristics

3. Physical Analysis

  • Summary of the Physical Analysis
  • Package
    • Package views and dimensions
    • Package opening and cross-section
  • Reflective Grating
    • Dimensions
    • Cross-section
  • Die
    • Details view, dimensions and markings
    • Color sensors
    • Active area deprocessing, die process
    • Die cross-section: metal layers, active area
    • Slit cross-section
    • Process characteristics
  • Comparison Between C12880MA and NanoLambda NSP32 and Consumer Physics SCIO Molecular sensor

4. Sensor Manufacturing Process

  • Overview
  • IC Front-End Process
  • Image Sensor Process Flow
  • Reflective Grating Process Flow
  • Packaging Process Flow

5. Cost Analysis

  • Summary of the Cost Analysis
  • Image Sensor
    • IC wafer front-end cost
    • Sensor layers wafer front-end cost
    • Sensor layers front-end cost per process step
    • Back-end 0: probe test and dicing wafer and die cost
  • Reflective Grating Cost
  • Component
    • Back-end: packaging cost
    • Back-end: final test cost
    • Component cost

6. Selling Price

For more information about this report visit

Did you know that we also offer Custom Research? Visit our Custom Research page to learn more and schedule a meeting with our Custom Research Manager.

         Laura Wood, Senior Manager
         For E.S.T Office Hours Call 1-917-300-0470
         For U.S./CAN Toll Free Call 1-800-526-8630
         For GMT Office Hours Call +353-1-416-8900
Related Topics: Laboratory Equipment

Primary Logo

View Comments and Join the Discussion!

Latest Ratings

JBLGoldman SachsUpgrades0.0
JRVRKeefe Bruyette & WoodsDowngrades40.0
ADMPB. Riley FBRDowngrades2.5
EAFVertical GroupDowngrades9.0
View the Latest Analytics Ratings
Don't Miss Out!
Join Our Newsletter
Subscribe to:
Market in 5 Minutes
Everything you need to know about the market - quick & easy.
Daily Analyst Rating
A summary of each day’s top rating changes from sell-side analysts on the street.
Fintech Focus
Your weekly roundup of hot topics in the exciting world of fintech.
Thank You
for registering for Benzinga’s newsletters and alerts.
• The Daily Analysts Ratings email will be received daily between 7am and 10am.
• The Market in 5 Minutes email will be received daily between 7am and 8am.
• The Fintech Focus email will be received every Friday between 2pm and 5pm.