Market Overview

Complete Teardown of Peraso's X710 Chipset 60GHz Outdoor Wireless Broadband Solution -


The "Peraso
X710 Chipset 60GHz Outdoor Wireless Broadband Solution Complete Teardown
report has been added to's

This report includes a full investigation of the system, featuring a
detailed study of the baseband processor, the RFIC and the antenna board
including die analyses, processes and board cross-sections. We focus on
the RFIC block diagram and the antenna board routing view and
dimensions. The report contains a complete cost analysis and a selling
price estimation of the chipset. Finally, it features an exhaustive
comparison with the Qualcomm chipset for router and handset applications.

Even though millimeter-wave (mmWave) technology has become better
defined this year, several questions remain unanswered. How will the
technology be implemented? Which manufacturing technology will be used?
Will it be used in cellphone handsets? Which companies will prevail in
the market? Today, the only glimpse of what could be done in the near
future is the WiGig application, which spans handsets, routers and
backhaul products. Qualcomm is already in prime position in
radio-frequency (RF) CMOS technology in handset applications. But for
backhaul, where the power and performance requirements are higher,
there's room for other technologies and competitors. Peraso Technologies
is one that is already well positioned, with several design wins for its
X710 chipset.

Peraso Technologies' three product series target consumer, industrial
and augmented and virtual reality (AR/VR) applications. The X series
chipset for outdoor wireless broadband solutions is composed of two
separate components, a baseband integrated circuit (IC) and an RFIC.
Integrated into the IgniteNet ML-690-LW device, the solution features
also a ceramic substrate-based phase array antenna. Soldered on the same
board as 32 antennae, the all-60GHz solution takes up only 5% of the
device volume.

Key Topics Covered:

1. Overview/Introduction

2. Company Profile and WiGig technology

3. IgniteNet ML-60-LW teardown

4. Market Analysis

5. Physical Analysis

  • Physical analysis methodology
  • Baseband IC and RF IC package analysis
  • Die analysis: Baseband processor and RF IC
  • Antenna board analysis
  • Physical analysis comparison
  • Peraso chipset - baseband vs. RFIC packaging
  • Peraso vs. Qualcomm chipset - baseband IC, RFIC, antennae
  • Backhaul vs. router vs. handset - chipset, form factor

6. Manufacturing process flow

  • Die fabrication unit: Baseband processor, RFIC
  • Packaging fabrication unit
  • Exposed die FCBGA package process flow

7. Cost Analysis

  • Overview of the cost analysis
  • Supply chain description
  • Yield hypotheses
  • Die cost analyses: Baseband processor, RFIC
  • Baseband and RFIC package cost analysis
  • Final test cost
  • Component coste Grating

8. Estimated price analysis

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