Market Overview

Global Embedded Die Packaging Market 2018-2022| Increasing Miniaturization of Devices Boosts Growth| Technavio

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Technavio
analysts forecast the global embedded die packaging market to grow at a
CAGR of almost 14% during the forecast period.

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Technavio has published a new market research report on the global embedded die packaging market fro ...

Technavio has published a new market research report on the global embedded die packaging market from 2018-2022. (Graphic: Business Wire)

The increasing interest in MEMS is one of the major trends being
witnessed in the global
embedded die packaging market 2018-2022
. Microelectromechanical
systems (MEMS) are miniaturized mechanical and electronic components
that are manufactured through micromachining processes. The dimensions
of MEMS devices can vary from 1 micron to several millimeters. The
growing focus on integrating advanced technologies in their devices by
mobile computing manufacturers is leading to the growth of the global
MEMS market.

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According to Technavio analysts, one of the key factors contributing to
the growth of the global embedded die packaging market is the growing
miniaturization of devices:

Global embedded die packaging market: Growing
miniaturization of devices

The rise in demand for miniaturized electronic components is being
witnessed in several sectors such as aerospace and defense, automotive,
consumer electronics, healthcare, industrial, and others. This drives
the demand for embedded die packaging due to the miniaturization of
electronic circuits in electronic devices.

According to a senior analyst at Technavio for research on semiconductor
equipment, "Embedded die packaging can be used across various
applications as it ensures smaller sized IC packages. The use of
embedded die technology has been increasing owing to features such as
better functionality and efficiency of the electronic circuit, reduced
size, improved signal inductance, higher reliability, and high signal
density."

Global embedded die packaging market:
Segmentation analysis

The global embedded die packaging market research report provides market
segmentation by application (consumer electronics, automotive, and
healthcare) and by region (the Americas, APAC, and EMEA). It provides an
in-depth analysis of the prominent factors influencing the market,
including drivers, opportunities, trends, and industry-specific
challenges.

APAC held the largest share of the market in 2017, accounting for close
to 69% share. It was followed by the Americas and EMEA, respectively.
The market share occupied by the APAC region is expected to increase by
almost 4% by 2022.

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Some of the key topics covered in the report include:

Market Landscape

  • Market ecosystem
  • Market characteristics
  • Market segmentation analysis

Market Sizing

  • Market definition
  • Market size and forecast

Five Forces Analysis

Market Segmentation

Geographical Segmentation

  • Regional comparison
  • Key leading countries

Market Drivers

Market Challenges

Market Trends

Vendor Landscape

  • Vendors covered
  • Vendor classification
  • Market positioning of vendors
  • Competitive scenario

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