Market Overview

Global Wafer-level Packaging (WLP) Market Outlook to 2026 -


The "Wafer-level
Packaging - Global Market Outlook (2017-2026)"
report has been
added to's offering.

According to the report, the global Wafer-level Packaging Equipment
market was estimated at $3.12 billion in 2017 and is projected to reach
$15.21 billion by 2026, at a CAGR of 19.2%.

The increasing demand for high-speed and compact size of electronic
products has expanded the need for wafer-level packaging market. In
addition, Internet of Things (IoT) has been gaining popularity and is
considered as the third wave of technology. The rising popularity of IoT
and portable electronics market is expected to foster the high growth of
the wafer-level packaging industry.

Moreover, WLP's technological superiority over traditional packaging
techniques and the impending need of circuit miniaturization in
microelectronic devices acts as drivers of the market growth. However,
encapsulation being a challenge for fan-out wafer-level packaging and
high initial investment functions is key constraints to the market.

Based on End-User, the electronics segment held steady growth during the
forecast period. Imminent need of size reduction in electronics devices,
requirement of higher data transmission speed, and improvement in
efficiency collectively fuel the replacement of conventional packaging
with WLP in electronics industry.

By geography, Asia Pacific held the largest market and will continue to
show due to the rising disposable incomes in the market. This is
accredited to the presence of various manufacturing facilities, high
consumption, and production of electronic products where WLP is steadily
replacing wire bond and ongoing R&D. The growing adoption of smartphones
in India will permit the market to experience a tumultuous rise in
demand. The production of wafer-level packaging will be focused more in
the APAC region.

Key Topics Covered

1 Executive Summary

2 Preface

3 Market Trend Analysis

4 Porters Five Force Analysis

5 Global Wafer-level Packaging Equipment Market, By Integration Type

6 Global Wafer-level Packaging Equipment Market, By Packaging Technology

7 Global Wafer-level Packaging Equipment Market, By Bumping Technology

8 Global Wafer-level Packaging Equipment Market, By End-User

9 Global Wafer-level Packaging Equipment Market, By Geography

10 Key Developments

11 Company Profiling

  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Siliconware Precision Industries
  • Infineon Technologies AG
  • Deca Technologies
  • KLA-Tencor Corporation
  • Nanium SA
  • China Wafer Level CSP Co. Ltd.
  • STATS ChipPAC Ltd.
  • Marvell Technology Group Ltd.
  • Amkor Technology Inc.
  • Qualcomm Inc.
  • Fujitsu Ltd.
  • Toshiba Corp.
  • Tokyo Electron Ltd.
  • Applied Materials Inc.

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