Market Overview

Global Thin Wafer Processing & Dicing Equipment Market Outlook to 2023: Analysis by Equipment Type, Technology, Application and Region - ResearchAndMarkets.com

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The "Global
Thin Wafer Processing and Dicing Equipment Market - Segmented by
Equipment Type (Processing and Dicing), Technology (Grinding, Grinding
and CPM, Blade Dicing, Laser Ablation), Application and Region - Growth,
Trends & Forecast (2018 - 2023)"
report has been added to ResearchAndMarkets.com's
offering.

The thin wafer processing and dicing equipment market is expected to
grow at a CAGR of over 6% during the forecast period (2018-2023).

Integration of microelectronics into several consumer electronics and
smart cards needed for thinner wafers are increasing rapidly.
Technologies like RFID, MEMS Devices, and power devices are considered
to be the major source of demand for these thin wafers. This scenario is
increasingly creating demand for better manufacturing process,
especially processing and dicing which are important phases of
ultra-thin wafer production.

Many new processes such as chemical mechanical polishing (CMP) are
increasingly being integrated into the processing phase along with
grinding operations to ensure smoothly polished wafer surface. With
increasing innovations in enterprise security solutions to manage
employees of the organization, upcoming foundries and semiconductor
manufacturing establishments and applications in consumer electronics
are expected to keep a steady demand for processing and dicing equipment
over the forecast period.

Key Highlights

  • Applications in RFID to Create a Huge Demand
  • Asia Pacific is growing at A Faster Pace

Developments in the Market

  • February 2018 - SPTS Technologies received approximately USD 37
    million in orders for multiple etch and deposition systems from two
    GaAs foundry customers. SPTS's Omega plasma etch, Delta PECVD, and
    Sigma PVD are expected to be installed in these foundries to
    manufacture radio frequency (RF) devices for 4G and emerging 5G
    wireless infrastructure.

Key Topics Covered

1. Introduction

2. Executive Summary

3. Market Overview

4. Market Dynamics

5. Global Thin Wafer Processing and Dicing Equipment Market Segmentation

6. Company Profiles

  • Suzhou Delphi Laser Co. Ltd
  • SPTS Technologies Limited (Orbotech)
  • Plasma-Therm LLC
  • Han's Laser Technology Co. Ltd
  • ASM Laser Separation International (ALSI) B.V.

7. Investment Analysis

8. Future of Global Thin Wafer Processing and Dicing Equipment Market

For more information about this report visit https://www.researchandmarkets.com/research/vwqwm7/global_thin_wafer?w=4

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