Market Overview

CyberOptics Demonstrates Industry-Leading Airborne Particle and Ultra High-Resolution MRS Sensors at SEMICON Taiwan


Significantly Improving Yields and Tool Uptime in Semiconductor Fabs

CyberOptics® Corporation (NASDAQ:CYBE), a leading global developer and
manufacturer of high precision 3D sensing technology solutions,
announces it will demonstrate its next generation Airborne Particle
Sensor™ technology (APS3) 300mm with new ParticleSpectrum™ software at SEMICON
, September 5-7 at the Nangang Exhibition Center in Taipei in
booth #L312.

This press release features multimedia. View the full release here:

WaferSense Airborne Particle Sensor (APS3) (Photo: Business Wire)

WaferSense Airborne Particle Sensor (APS3) (Photo: Business Wire)

CyberOptics' WaferSense® APS3
speeds equipment set-up and long-term yields in semiconductor fabs by
wirelessly detecting, identifying and monitoring airborne particles. Now
in a thinner and lighter form factor to travel through semiconductor
tools with ease, the APS3 offers leading accuracy and sensitivity valued
by equipment and process engineers.

"Semiconductor fabs worldwide have adopted our Airborne Particle
Sensors," said Dr. Subodh Kulkarni, President and CEO, CyberOptics. "We
have further advanced the technology that they rely on to significantly
improve their yields and tool uptime."

The APS3 solution incorporates ParticleSpectrum software – a completely
new, touch-enabled interface with user-friendly functionality, making it
simple to read, record and review small to large airborne particle data
and see the effects of cleanings, adjustments and repairs in real-time.

At SEMICON Taiwan, CyberOptics will also demonstrate the proprietary 3D
Ultra High-Resolution Multi-Reflection Suppression (MRS) Sensor
technology that meticulously identifies and rejects reflections caused
by shiny components and surfaces. Effective suppression of multiple
reflections is critical for highly accurate measurements. Offering an
unmatched combination of accuracy and speed, MRS sensors are widely used
for inspection and measurement in the SMT, metrology and in
semiconductor markets. This best in class, ultra high-resolution
technology used in back-end inspection applications, is ideally suited
for IC package, wafer bump inspection and mid-end semiconductor
applications where the highest degree of precision is required.

For more information about the entire line of CyberOptics solutions
please visit

About CyberOptics

CyberOptics Corporation (
is a leading global developer and manufacturer of high precision sensing
technology solutions. CyberOptics' sensors are used in SMT,
semiconductor and metrology markets to significantly improve yields and
productivity. By leveraging its leading edge technologies, the company
has strategically established itself as a global leader in high
precision 3D sensors, allowing CyberOptics to further increase its
penetration of key vertical markets. Headquartered in Minneapolis,
Minnesota, CyberOptics conducts worldwide operations through its
facilities in North America, Asia and Europe.

Statements regarding the company's anticipated performance are
forward-looking and therefore involve risks and uncertainties, including
but not limited to: market conditions in the global SMT and
semiconductor capital equipment industries; the timing of orders and
shipments of our products, particularly our 3D MRS-enabled AOI systems;
increasing price competition and price pressure on our product sales,
particularly our SMT systems; the level of orders from our OEM
customers; the availability of parts required to meet customer orders;
unanticipated product development challenges; the effect of world events
on our sales, the majority of which are from foreign customers; rapid
changes in technology in the electronics markets; product introductions
and pricing by our competitors; the success of our 3D technology
initiatives; the market acceptance of our SQ3000 3D CMM system, mid-end
semiconductor inspection sensors and CyberGage360 product; costly and
time consuming litigation with third parties related to intellectual
property infringement; and other factors set forth in the company's
filings with the Securities and Exchange Commission.

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