Market Overview

Toshiba Memory Spotlights Recent 96-Layer BiCS FLASH 3D Flash Memory Breakthroughs at Flash Memory Summit

Share:

Company to Demonstrate Broad Range of Flash Memory Solutions Designed
to Scale for the Workloads of the Future

This week at Flash
Memory Summit
(FMS), Toshiba
Memory America, Inc.
, the U.S.-based subsidiary of Toshiba Memory
Corporation, will highlight recent advancements surrounding its
industry-leading BiCS FLASH™ 3D flash memory in several applications.
Toshiba will publicly unveil a prototype of its new 96-layer
BiCS FLASH with QLC technology
, which boosts single-chip memory
capacity to the highest level yet achieved. Also making its debut will
be the new XG6 series of SSDs, which are the industry's
first SSDs based on 96-layer 3D flash memory
.

This press release features multimedia. View the full release here:
https://www.businesswire.com/news/home/20180806005159/en/

Toshiba Memory has the new products, capacity, and technologies to help customers scale and prepare  ...

Toshiba Memory has the new products, capacity, and technologies to help customers scale and prepare for the challenges of tomorrow. (Graphic: Business Wire)

Toshiba Memory will also demonstrate groundbreaking technologies in
several different applications, including its broad lineup of client,
enterprise and data center SSD solutions and industry-leading UFS™1.
Demonstrations will take place in the company's two-level booth (#307,
Hall A) on the show floor at the Santa Clara Convention Center from
August 7-9. Additionally, Toshiba Memory will deliver a keynote
presentation and present in multiple sessions on various technologies
and topics surrounding SSDs and new flash technologies and applications.

In keeping with this year's FMS theme of designing for big data demands,
Toshiba Memory is focused on collaborating with its customers and
technology partners to power the digital transformation of business –
where growth relies increasingly on data. According to Jeremy Werner,
vice president of SSD marketing and product planning at Toshiba Memory
America, Inc., "The fastest growing applications and workloads are
creating massive amounts of data at a pace that is accelerating every
day. The ability to manage and monetize that valuable data requires
architectures that are built from the ground up to rely on the fastest,
SSD-enabled storage. With the leading-edge SSD technologies and products
we are demonstrating at Flash Memory Summit this year, Toshiba Memory's
SSD product lines are the ideal foundation today for the most innovative
platforms that we will grow to rely on tomorrow."

"From being the first to introduce the concept of 3D flash memory to our
most recent breakthrough with 96-layer QLC BiCS FLASH, Toshiba has
demonstrated the technology leadership and vision needed to stay in
front of the fast-moving storage market," noted Scott Nelson, senior
vice president of Toshiba Memory America, Inc.'s Memory Business
Unit. "We have consistently delivered industry-leading,
first-of-their-kind technologies that address the data storage
challenges being presented by existing and emerging applications. Moving
forward, we will continue to champion the ability of BiCS FLASH to
enable high-density storage solutions."

FMS Featured Keynote Presentation
"Scaling Flash
Technology to Meet Application Demands"

Tuesday, August 7
from 11:40 a.m. – 12:10 p.m.

Shigeo (Jeff) Ohshima, technology executive, SSD application engineering
at Toshiba Memory America, Inc., will present a keynote session titled:
"Scaling Flash Technology to Meet Application Demands." The session will
explore flash memory's key role in the storage systems that will enable
the digital transformation of enterprise and hyperscale data centers.

FMS Breakout Sessions and Tutorials

  • Steven Wells – IO Determinism and QLC
  • Ram Johri – Kubernetes Platform for IoT Use Cases at the Edge
  • Sudhakar Mungamoori – Scaling Stateful Containers for Cloud-Native
    Applications with Elastic and High-Performance NVMe over Fabrics™2
    (NVMe-oF™) Storage Provider
  • Drew Tipton – Data Encryption – TCG Ruby
  • Chander Chadha – NVMe™ SSD/PMR (with NetApp)
  • Rob Sykes – Off Module Power Loss Protection (PLP)

FMS Demos

Live demos at the Toshiba booth will include:

  • KumoScale™3 (NVMe over Fabrics Shared Accelerated Storage
    Software)
  • Interactive 8K Visualization of Nanoscale Brain Images featuring CM5
    eSSDs and KumoScale NVMe-oF Shared Accelerated Storage Software
  • Client PCIe®4 SSD Portfolio (including newly announced XG6)
  • Data Center SSD Solutions (HK6, CD5, XD5)
  • Enterprise SSD Solutions (PM5, CM5, U.3)
  • Native NVMe-oF SSDs
  • Qualcomm®5 Snapdragon™6 845 Mobile Development
    Platform with Toshiba UFS
  • Qualcomm Snapdragon 820A Automotive Development Platform with Toshiba
    UFS

For more information, please visit business.toshiba-memory.com.

Notes:

  1. Universal Flash Storage (UFS) is a trademark and product category for
    a class of embedded memory products built to the JEDEC UFS standard
    specification.
  2. NVMe, NVM Express, and NVMe-oF are trademarks of NVM Express.
  3. KumoScale is a trademark of Toshiba Memory Corporation.
  4. PCIe and PCI Express are registered trademarks of PCI-SIG.
  5. Qualcomm is a registered trademark of Qualcomm Incorporated.
  6. Qualcomm Snapdragon is a trademark of Qualcomm Incorporated.

About Toshiba Memory America, Inc.

Toshiba Memory America, Inc. is the U.S.-based subsidiary of Toshiba
Memory Corporation
, a leading worldwide supplier of flash
memory
and solid
state drives (SSDs)
. From the invention of flash memory to today's
breakthrough 96-layer BiCS FLASH™ 3D technology, Toshiba continues to
lead innovation and move the industry forward. For more information on
Toshiba Memory, please visit business.toshiba-memory.com
and follow the company on LinkedIn,
Twitter (@Toshiba_Memory)
and Facebook.

© 2018 Toshiba Memory America, Inc. All rights reserved. Information in
this press release, including product pricing and specifications,
content of services, and contact information is current and believed to
be accurate on the date of the announcement, but is subject to change
without prior notice. Technical and application information contained
here is subject to the most recent applicable Toshiba product
specifications.

View Comments and Join the Discussion!