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Xperi Partners With UMC to Support Production of Direct and Hybrid Bonding 3D Semiconductor Technologies

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Partnership enables UMC to develop and manufacture products utilizing
Invensas DBI and ZiBond technologies

Xperi
Corporation
(NASDAQ:XPER) ("Xperi") is pleased to announce a
partnership with leading global semiconductor foundry, UMC. This
strategic partnership will enable the companies to support the
growing demand for Invensas ZiBond® and Invensas DBI®
3D semiconductor technologies.

Together, Xperi and UMC will further optimize and commercialize the
ZiBond and DBI technologies for a wide range of semiconductor devices
including image sensors, radio frequency (RF), MEMS, display drivers,
touch controllers, SoC, analog, power and mixed-signal devices. Wafer to
wafer (W2W) and die to wafer (D2W) bonding and 3D interconnect
implementations will be employed to address the requirements of a
variety of applications within the mobile, consumer, automotive,
communication, industrial and Internet of Things (IoT) industries.

"As a world-leading semiconductor foundry, we are committed to
delivering leading-edge solutions to our customers," said Wenchi Ting,
vice president of specialty technologies at UMC. "By partnering with
Xperi and the Invensas team, true pioneers in direct and hybrid bonding
technologies, we continue to be well-positioned to meet our customers'
evolving requirements for advanced wafer bonding technologies."

"We are excited to join forces with UMC, a premier global foundry
engaged in every major sector of the electronics industry, to expand the
production base for our ZiBond and DBI bonding and 3D interconnect
platforms," said Craig Mitchell, president, Invensas. "We look forward
to working together to proliferate these enabling technologies into a
wide range of high volume semiconductor applications."

ZiBond is a low temperature homogenous direct bonding technology that
forms strong bonds between semiconductor wafers or die with same or
different coefficients of thermal expansion. This technology is used in
image sensors, MEMS and various RF front-end devices.

DBI is a low temperature hybrid direct bonding technology that allows
semiconductor wafers or die to be bonded with exceptionally fine pitch
3D electrical interconnect. This technology is suited for various
semiconductor devices such as image sensors, DRAM, MEMS and RF devices.

Products employing these technologies are found in smartphones, tablets,
laptops, cameras, televisions and gaming consoles, as well as in
industrial, automotive and IoT electronic devices.

For more information about Xperi and its technologies platforms, please
visit www.xperi.com.

About Xperi Corporation

Xperi Corporation (NASDAQ:XPER) and its brands, DTS, FotoNation, HD
Radio, Invensas and Tessera, are dedicated to creating innovative
technology solutions that enable extraordinary experiences for people
around the world. Xperi's solutions are licensed by hundreds of leading
global partners and have shipped in billions of products in areas
including premium audio, automotive, broadcast, computational imaging,
computer vision, mobile computing and communications, memory, data
storage, and 3D semiconductor interconnect and packaging. For more
information, please call 408-321-6000 or visit www.xperi.com.

About UMC

UMC (NYSE:UMC, TWSE: 2303)) is a leading global semiconductor foundry
that provides advanced IC production for applications spanning every
major sector of the electronics industry. UMC's comprehensive foundry
solutions enable chip designers to leverage the company's sophisticated
technology and manufacturing, which include world-class 28nm
High-K/Metal Gate technology, 14nm FinFET volume production, specialty
process platforms specifically developed for AI, 5G and IoT applications
and the automotive industry's highest-rated AEC-Q100 Grade-0
manufacturing capabilities for the production of ICs found in vehicles.
UMC's 11 wafer fabs are strategically located throughout Asia and are
able to produce over 600,000 wafers per month. The company employs more
than 20,000 people worldwide, with offices in Taiwan, China, Europe,
Japan, Korea, Singapore, and the United States. UMC can be found on the
web at http://www.umc.com.

Invensas, Xperi and their respective logos are trademarks or
registered trademarks of affiliated companies of Xperi Corporation in
the United States and other countries. All other company, brand and
product names may be trademarks or registered trademarks of their
respective companies.

SOURCE: XPERI CORPORATION

XPER-I

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