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Helix Semiconductors Receives 2018 Global Power Conversion Module New Product Innovation Award from Frost & Sullivan

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IRVINE, Calif., July 25, 2018 (GLOBE NEWSWIRE) -- Today, fabless power semiconductor company Helix Semiconductors announced that it has received a Best Practices Award from research and consulting firm Frost & Sullivan for the third consecutive year. These awards recognize companies across the globe for superior leadership, technological innovation and strategic product development. This year, Helix Semiconductors has received the Global Power Conversion Module New Product Innovation Award for its MxC™ 100 and MxC 200 high-efficiency and high-power density chipsets. President and CEO Harold A. Blomquist accepted the award last week at a gala in Nashville, Tennessee.

Helix Accepts Frost & Sullivan Award
Helix Semiconductors President & CEO Harold A. Blomquist accepts the Global Power Conversion Module New Product Innovation Award from Frost & Sullivan.



To determine recipients of the New Product Innovation Award, Frost & Sullivan analysts evaluate candidates based on two key factors: new product attributes and customer impact. According to Frost & Sullivan, "Helix Semiconductors' innovative and patented chipsets, the MxC 100 and MxC 200, are disrupting existing power conversion techniques by achieving nearly zero power loss – the gold standard of energy efficiency. The company's proprietary MuxCapacitor™ technology guarantees product developers the ability to design consumer electronic goods and IoT devices with unmatched energy efficiency of 90 to 95 percent. Manufacturers will not only enjoy higher energy efficiency but also an increased ROI due to the reduced cost of product development."

Helix's MuxCapacitor-based capacitive voltage conversion and capacitive isolation technologies maximize power density and energy efficiency in electronic devices – including those left connected and idle in standby mode or operating in low-load conditions for AC-DC and DC-DC power supply markets, respectively.

"Our sights are set on offering innovative products, such as our future MxC 300 transformerless chipset, that will enable best-in-class power density and energy efficiency for AC-DC and DC-DC power supply solutions," said Blomquist. "We are proud to be honored by Frost & Sullivan for our achievements for the third consecutive year, and we will continue to push the envelope with our technology to reduce energy waste and improve energy efficiency."

The Global Power Conversion Module New Product Innovation Award is the third honor Helix Semiconductors has received from Frost & Sullivan since the company's inception in 2012. Previous awards include the New Product Innovation Award in IoT and the Entrepreneurial Company of the Year Award.

For more about Helix Semiconductors, please visit www.helixsemiconductors.com.

About Frost & Sullivan

Frost & Sullivan, the Growth Partnership Company, enables clients to accelerate growth and achieve best-in-class positions in growth, innovation and leadership. The company leverages more than 50 years of experience in partnering with Global 1000 companies, emerging businesses, and the investment community from 45 offices on six continents. For more, please visit www.frost.com. 

About Helix Semiconductors

Helix Semiconductors is a fabless power semiconductor company focused on developing energy-efficient digital power solutions. At a time when worldwide energy shortages are a reality and strict new efficiency standards are being enacted globally, Helix Semiconductors is creating impactful, energy-efficient power conversion products that are friendly to humans and the environment.

Applications addressed by Helix Semiconductors' power conversion technology include the billions of devices in the consumer, computer, telecom, medical, and industrial markets. To learn more, please visit the company website at www.helixsemiconductors.com and follow them on LinkedIn and Twitter.

Media Contact:
Stephanie Olsen
Lages & Associates
(949) 453-8080
stephanie@lages.com

A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/12ecd80d-4b8d-491b-8561-f13ca4207aad

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