Market Overview

Global Semiconductor Wafer Cleaning Equipment (SWCE) Market to Witness a CAGR of 14.4% during 2018-2024

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NEW YORK, July 20, 2018 (GLOBE NEWSWIRE) -- The global semiconductor wafer cleaning equipment (SWCE) market was valued at USD 2.6 billion in 2017 and is expected to reach USD 6.8 billion by 2024, at a CAGR of 14.4%. Factors driving the growth of the market are; increasing demand for reliable process solutions in advanced cleaning applications, rising capital investments in consumer electronics, and advancements in technology. Moreover, increasing adoption of smart phones and tablets across the globe is also expected to augment the market growth during the forecast period. 

In the fabrication of semiconductor devices, wafer cleaning has become the primary and critical operation.  The aim of wafer cleaning equipment is to remove the chemical impurities without altering or harming the wafer substrate. Presence of undesired materials in the wafer while manufacturing semiconductor leads to degradation of product quality. Moreover, with decreasing size of the semiconductor devices, the need to eliminate smaller particles from silicon wafers has become very critical in order to improve the performance of the semiconductor device and its reliability. To reduce defect density and enhance yields, SWCE is employed to remove particle contaminants efficiently.

Increasing Demand for Single Wafer Processing

Miniaturization of electronic devices and high performance equipment is significantly driving the market growth.  The faster adoption and increasing requirement of smart gadgets and printed electronics is boosting the demand for single wafer processing. In order to prevent contamination, cleaning of wafer is of primary importance. For single wafer processing, hydrofluoric acid and ozonized water are combined in single spin technology to decrease the cycle times and improve output flexibility.

Semiconductor Wafer Cleaning Equipment (SWCE) Market - Regional Insight

Asia-Pacific is expected to dominate the global semiconductor wafer cleaning equipment market followed by Europe. The growth in the Asia-Pacific region is mainly attributed to the increasing demand of portable consumer electronics devices and steadily evolving technology. Moreover, presence of major semiconductor and manufacturing industries in APAC is also driving the growth of the market in this region. China holds the major share of the SWCE market in APAC and is expected to retain its dominance during the forecast period. North America is anticipated to show a significant growth rate, owing to the increasing adoption of consumer appliances.

Browse full research report with TOC on "Global Semiconductor Wafer Cleaning Equipment (SWCE) Market Outlook, Trend and Opportunity Analysis, Competitive Insights, Actionable Segmentation & Forecast 2024" at: https://www.energiasmarketresearch.com/global-semiconductor-wafer-cleaning-equipment-market-report/

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Key findings from the report:

  • 300mm wafer size is expected to register the highest CAGR during the forecast period, owing to the increasing usage in different applications such as MEMS, LEDs, and others.

  • Based on equipment type, Rotary Wafer Etching System holds the major market share in 2017.
  • On the basis of operation type, the largest market share is accounted by batch spray cleaning systems in 2017, due to its increasing demand in MEMS manufacturing. The single-wafer spray systems is expected to be fastest growing segment during 2018-2024
  • On the basis of application, LED is the fastest growing segment on account of increasing commercial use of LEDs.

  • Key players in the global semiconductor wafer cleaning equipment market include Lam Research Corporation; SCREEN Holdings Co. Ltd.; Tokyo Electron Limited; Cleaning Technologies Group; AP&S; Modutek Corporation; Entegris, Inc.; Shibaura Mechatronics Corporation; Ultron Systems, Inc.; Axus Technologies;  among others.

The report segments the global semiconductor wafer cleaning equipment market on the basis of wafer size, wafer cleaning systems, technology, equipment type, operation type, impurity, application end-use, and region.

By Wafer Size

  • 125mm
  • 200 mm
  • 300 mm

By Wafer Cleaning System

  • Auto Wet Station
  • Spin Processor
  • Spin Scrubber

By Technology

  • Wet Chemistry-Based Cleaning Technology
  • Etch Cleaning Technology
  • Front Side up Cleaning Technology

By Equipment Type

  • Rotary Wafer Etching System
  • Semi-Automated Wet Batch System
  • Manual Wet Batch System

By Operation Type

  • Single-wafer spray systems
  • Single-wafer cryogenic systems
  • Batch immersion cleaning systems
  • Batch spray cleaning systems
  • Scrubbers

By Impurity

  • Metallic Contamination
  • Chemical Contamination
  • Particle Contamination

By Application/ End-Use

  • LED
  • Interposer
  • MEMS
  • CIS
  • Memory
  • RF Device
  • Logic

By Region

  • North America
       •   U.S.
       •   Canada
  • Europe
       •   UK
       •   France
       •   Italy
       •   Germany
       •   Rest of Europe
  • Asia-Pacific (APAC)
       •   China
       •   Japan
       •   India
       •   Taiwan
       •   South Korea
       •   Rest of APAC
  • Middle East and Africa
       •   Israel
       •   South Africa
       •   Rest of Middle East and Africa
  •  Central and South America
       •   Brazil
       •   Mexico
       •   Rest of South America

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