Market Overview

Asia Pacific Wi-Fi Module Market Analysis & Forecasts 2018-2024, With an Expected CAGR of 12.4% - ResearchAndMarkets.com

Share:

The "Asia
Pacific Wi-Fi Module Market Analysis (2018-2024)"
report has
been added to ResearchAndMarkets.com's offering.

The Asia Pacific Wi-Fi Module Market is expected to witness market
growth of 12.4% CAGR during the forecast period (2018 - 2024).

A Wi-Fi module is an independent system on a chip (SoC), integrated
using TCP/IP stack, which provide access to the Wi-Fi networks. Adoption
of cloud computing and rapid growth in telecommunication, residential,
and commercial sectors are contributing to the growth of the market.
However, privacy and security issues is expected to limit the market
growth significantly.

Based on Type, the market is segmented into Router Scheme and Embedded.
Based on Application, the market is segmented into Smart Grid & Smart
Appliance, Handheld Mobile Device, Medical & Industrial Testing
Instrument, and Others. Based on countries, the Wi-Fi Module market
segments the market into China, Japan, India, South Korea, Singapore,
Malaysia, and Rest of Asia Pacific.

Companies Mentioned

  • Murata Manufacturing Co., Ltd.
  • Microchip Technology Incorporated
  • Taiyo Yuden Co., Ltd.
  • AzureWave Technologies, Inc.
  • Silicon Laboratories, Inc.
  • Laird PLC
  • BroadLink
  • Advantech Co., Ltd.
  • Shanghai MXCHIP Information Technology Co., Ltd.
  • Silex Technology, Inc.

Key Topics Covered:

Chapter 1. Market Scope & Methodology

Chapter 2. Market Overview

Chapter 3. Asia Pacific Wi-Fi Module Market

Chapter 4. Asia Pacific Wi-Fi Module Market by Application

Chapter 5. Asia Pacific Wi-Fi Module Market by Country

Chapter 6. Company Profiles

For more information about this report visit https://www.researchandmarkets.com/research/z7fszs/asia_pacific?w=4

View Comments and Join the Discussion!