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Power Discrete Packaging Comparison - 2018 Complete Teardown Report - ResearchAndMarkets.com

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The "Power
Discrete Packaging Comparison 2018 Complete Teardown Report"

report has been added to ResearchAndMarkets.com's
offering.

The most recent market forecast by the publisher shows the global rise
of power devices. The market for discrete devices will follow that
trend, increasing in value by an estimated $1.5 billion in the next five
years.

In recent years the packaging market industry has stabilized around some
standard formats and footprints. But the race for optimization is far
from over.

The electric and hybrid electric vehicle markets are evolving fast, as
are other aspects of electrification of transportation. This, and more
generally the power electronic market's growth, has induced competition
between component manufacturers.

In the race to innovation and efficiency, the semiconductor die itself
isn't the only key to success. In fact, when chasing after the optimum
configuration for electrical, thermal and mechanical performance,
manufacturers also must battle with the mechanical reliability and cost
of packaging. More than a simple shell, the packaging surrounding the
dies can make or break a design.

To satisfy an industry where standardization and return on experience'
are key elements of success, seemingly small but smart tweaks around
common packages can turn out to be highly differentiating.

Through physical analyses, including chemical opening, cross-sections,
and various measurements, this report tries to summarize the state of
the art of packaging power semiconductors at a discrete level. With a
cost-oriented viewpoint, we reveal the hidden details that make the
difference between over 20 types of packages, ranging from mW to kW
designs.

Key Topics Covered:

1. Overview/Introduction

Executive Summary

Reverse Costing Methodology

Devices Analyzed

2. Introduction

Discrete Market

3. Physical Analysis

  • 31.3mm
    • SOT23
  • 31.6mm
    • TSOP6
  • 3x3mm
    • SON3x3
    • TSMT8
  • 4.52.5mm
    • SOT89
    • SOIC-8
  • 5x6mm
    • PowerFLAT 56
    • PowerFLAT 56 double island
    • PowerFLAT 56 dual side cooling
    • SOP advance
  • 10x10mm
    • D2PAK7
    • H2PAK
    • PSOFA-008
    • TO-220
  • 15x20mm
    • TO-247

4. Manufacturing process flow

5. Cost Simulation

6. Comparison

For more information about this report visit https://www.researchandmarkets.com/research/jh2wxt/power_discrete?w=4

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