Market Overview

Apple iPhone X - MEMS Microphones Complete Teardown Report 2018 - ResearchAndMarkets.com

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The "Apple
iPhone X - MEMS Microphones Complete Teardown Report"
report
has been added to ResearchAndMarkets.com's offering.

For microphone integration in the iPhone X, Apple has chosen the
market's top three microphone suppliers: Goertek, Knowles, and AAC
Technologies.

The Apple iPhone X has four MEMS microphones: a front-facing top
microphone, two front-facing bottom microphones, and a rear-facing top
microphone. This layout is similar to previous iPhones, but the
front-facing bottom-right microphone is now integrated in the speaker
module. All four microphones share the same Apple-specific package
dimensions, but with a different internal structure (number of substrate
metal layers, embedded capacitance, ASIC, etc.).

In the iPhone X, we've observed changes to the microphones provided by
Apple's three suppliers:

Goertek, which still relies on Infineon for die manufacturing,
integrates Infineon's technology with a double backplate, delivering a
differential MEMS microphone. For the ASIC, Goertek has considerably
reduced the die area by around 40% compared to the previous die.

Knowles uses the same technologies as before, but one part has a new
MEMS design and another part has an existing MEMS design.

AAC uses the same MEMS microphone die as Goertek, but with a different
ASIC.

Infineon is a big winner. By providing ASIC and MEMS dies to all of
Goertek's and AAC Technologies' products, it now possesses a large share
of the MEMS microphone market.

Key Topics Covered:

Overview/Introduction

Company Profile and Supply Chain

iPhone X - Teardown

Goertek/Knowles/AAC Technologies

Physical Analysis

  • Package
    • Package view and dimensions
    • Package opening
    • Package cross-section
  • ASIC Die
    • View, dimensions and marking
    • Dicing
    • Delayering and process
    • Cross-section
  • MEMS Die
    • View, dimensions and marking
    • Dicing
    • Membrane and backplate
    • Anti-stiction bumps
    • Cavity
    • Cross-section

Manufacturing Process Flow

  • ASIC Front-end Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

Physical Analysis Comparison

Goertek/Knowles/AAC Technologies - Cost Analysis

  • Cost Analysis Overview
  • Yield Hypotheses
  • ASIC Front-end Cost
  • ASIC Wafer and Die Cost
  • MEMS Front-end Cost
  • MEMS Wafer and Die Cost
  • Back-end: Packaging Cost
  • Microphone Component Cost

Goertek/Knowles/AAC Technologies - Estimated Sales Price

Manufacturing Cost Comparison

For more information about this report visit https://www.researchandmarkets.com/research/k38p2l/apple_iphone_x?w=4

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